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Journal: Materials, 2022
Volume: 15
Number: 1397

Article: Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices
Authors: by Chin-Hao Tsai, Wei-Chen Huang and Chengheng Robert Kao
Link: https://www.mdpi.com/1996-1944/15/4/1397

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