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Journal: Materials, 2022
Volume: 15
Number: 9004
Article:
Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
Authors:
by
Dongdong Chen, Junhu Qin, Xin Zhang, Dongcheng Liang, Hailong Bai, Jianhong Yi and Jikang Yan
Link:
https://www.mdpi.com/1996-1944/15/24/9004
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