Damage Evolution and Fracture Behavior of C/SiC Minicomposites with Different Interphases under Uniaxial Tensile Load
1
Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
2
College of Civil Aviation, Nanjing University of Aeronautics and Astronautics, No. 29 Jiangjun Ave., Nanjing 211106, China
3
State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China
*
Authors to whom correspondence should be addressed.
Academic Editor: Fabrizio Roccaforte
Materials 2021, 14(6), 1525; https://doi.org/10.3390/ma14061525
Received: 21 February 2021
/
Revised: 15 March 2021
/
Accepted: 16 March 2021
/
Published: 20 March 2021
(This article belongs to the Special Issue Damage, Fracture and Fatigue of Ceramic Matrix Composites (CMCs))
In this paper, the tensile damage and fracture behavior of carbon fiber reinforced silicon carbide (C/SiC) minicomposites with single- and multiple-layer interphases are investigated. The effect of the interphase on the tensile damage and fracture behavior of C/SiC minicomposites is analyzed. The evolution of matrix cracking under the tensile load of the C/SiC minicomposite with a notch is observed using the digital image correlation (DIC) method. The damage evolution process of the C/SiC minicomposite can be divided into four main stages, namely, (1) an elastic response coupled with partial re-opening of thermal microcracking; (2) multiple matrix microcracking perpendicular to the applied loading; (3) crack opening and related fiber/matrix, bundle/matrix, and inter-bundle debonding; and (4) progressive transfer of the load to the fibers and gradual fiber failure until composite failure/fracture. On the fracture surface, a large number of fibers pulling out of the samples with both single-layer and multi-layer interphases can be clearly observed.
View Full-Text
Keywords:
ceramic matrix composites (CMCs); C/SiC; minicomposite; matrix cracking; interface debonding; fiber pullout
▼
Show Figures
Figure 1
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Zhang, Z.; Li, L.; Chen, Z. Damage Evolution and Fracture Behavior of C/SiC Minicomposites with Different Interphases under Uniaxial Tensile Load. Materials 2021, 14, 1525. https://doi.org/10.3390/ma14061525
AMA Style
Zhang Z, Li L, Chen Z. Damage Evolution and Fracture Behavior of C/SiC Minicomposites with Different Interphases under Uniaxial Tensile Load. Materials. 2021; 14(6):1525. https://doi.org/10.3390/ma14061525
Chicago/Turabian StyleZhang, Zhongwei, Longbiao Li, and Zhaoke Chen. 2021. "Damage Evolution and Fracture Behavior of C/SiC Minicomposites with Different Interphases under Uniaxial Tensile Load" Materials 14, no. 6: 1525. https://doi.org/10.3390/ma14061525
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
