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Journal: Materials, 2021
Volume: 14
Number: 6394

Article: Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
Authors: by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K. N. Tu and Chih Chen
Link: https://www.mdpi.com/1996-1944/14/21/6394

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