Kozłowski, P.; Czuba, K.; Chmielewski, K.; Ratajczak, J.; Branas, J.; Korczyc, A.; Regiński, K.; Jasik, A.
Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials 2021, 14, 6269.
https://doi.org/10.3390/ma14216269
AMA Style
Kozłowski P, Czuba K, Chmielewski K, Ratajczak J, Branas J, Korczyc A, Regiński K, Jasik A.
Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials. 2021; 14(21):6269.
https://doi.org/10.3390/ma14216269
Chicago/Turabian Style
Kozłowski, Paweł, Krzysztof Czuba, Krzysztof Chmielewski, Jacek Ratajczak, Joanna Branas, Adam Korczyc, Kazimierz Regiński, and Agata Jasik.
2021. "Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing" Materials 14, no. 21: 6269.
https://doi.org/10.3390/ma14216269
APA Style
Kozłowski, P., Czuba, K., Chmielewski, K., Ratajczak, J., Branas, J., Korczyc, A., Regiński, K., & Jasik, A.
(2021). Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials, 14(21), 6269.
https://doi.org/10.3390/ma14216269