Jiang, H.; Yan, G.; Li, J.; Xu, J.; Shan, D.; Guo, B.
Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper. Materials 2021, 14, 4869.
https://doi.org/10.3390/ma14174869
AMA Style
Jiang H, Yan G, Li J, Xu J, Shan D, Guo B.
Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper. Materials. 2021; 14(17):4869.
https://doi.org/10.3390/ma14174869
Chicago/Turabian Style
Jiang, Hongpeng, Guangqiang Yan, Jianwei Li, Jie Xu, Debin Shan, and Bin Guo.
2021. "Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper" Materials 14, no. 17: 4869.
https://doi.org/10.3390/ma14174869
APA Style
Jiang, H., Yan, G., Li, J., Xu, J., Shan, D., & Guo, B.
(2021). Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper. Materials, 14(17), 4869.
https://doi.org/10.3390/ma14174869