Order Article Reprints

Kim W-J, Bang I-Y, Kim J-H, Park Y-S, Kwon H-T, Shin G-W, Kang M-H, Cho Y, Kwon B-H, Kwak J-H, et al. Silicon Oxide Etching Process of NF₃ and F₃NO Plasmas with a Residual Gas Analyzer. Materials. 2021; 14(11):3026. https://doi.org/10.3390/ma14113026

Kim, Woo-Jae, In-Young Bang, Ji-Hwan Kim, Yeon-Soo Park, Hee-Tae Kwon, Gi-Won Shin, Min-Ho Kang, Youngjun Cho, Byung-Hyang Kwon, Jung-Hun Kwak, and et al. 2021. "Silicon Oxide Etching Process of NF₃ and F₃NO Plasmas with a Residual Gas Analyzer" Materials 14, no. 11: 3026. https://doi.org/10.3390/ma14113026

Kim, W.-J., Bang, I.-Y., Kim, J.-H., Park, Y.-S., Kwon, H.-T., Shin, G.-W., Kang, M.-H., Cho, Y., Kwon, B.-H., Kwak, J.-H., & Kwon, G.-C. (2021). Silicon Oxide Etching Process of NF₃ and F₃NO Plasmas with a Residual Gas Analyzer. Materials, 14(11), 3026. https://doi.org/10.3390/ma14113026