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Journal: Materials, 2020
Volume: 13
Number: 1266

Article: Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs
Authors: by Na Wu, Yongfang Hu and Shufeng Sun
Link: https://www.mdpi.com/1996-1944/13/6/1266

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