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Journal: Materials, 2020
Volume: 13
Number: 1130
1130
Article: Metallization and Diffusion Bonding of CoSb₃-Based Thermoelectric Materials
Authors: by Hangbin Feng, Lixia Zhang, Jialun Zhang, Wenqin Gou, Sujuan Zhong, Guanxing Zhang, Huiyuan Geng and Jicai Feng
Link: https://www.mdpi.com/1996-1944/13/5/1130

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