Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film
1
ROHM Co., Ltd., Kyoto 615-8585, Japan
2
Faculty of Engineering, Uzumasa, Kyoto University of Advanced Science, Kyoto 615-8577, Japan
3
Department of Mechanical Engineering, Yakusa, Aichi Institute of Technology, Toyota 470-0392, Japan
*
Author to whom correspondence should be addressed.
Materials 2020, 13(18), 4061; https://doi.org/10.3390/ma13184061
Received: 6 August 2020
/
Revised: 7 September 2020
/
Accepted: 11 September 2020
/
Published: 13 September 2020
(This article belongs to the Special Issue Micro/Nanomechanics: From Theory to Application)
This paper investigates the influence of temperature on tensile mechanical properties of sintered silver (s-Ag) films with 8–10 μm in thickness for fundamental reliability design of semiconductor systems. The s-Ag film sintered under a pressure of 60 MPa possesses the porosity (p) around 5% determined from cross-sectional scanning electron microscope (SEM) images. The stress–strain (S-S) curves of s-Ag and pure silver (p-Ag) films are obtained using originally designed uniaxial tensile tester at temperatures from 25 °C to 150 °C. The S-S curves of p-Ag indicate ductile behavior irrespective of temperature, whereas those of s-Ag indicate brittle-ductile transition at 120 °C. Compared with p-Ag, s-Ag possesses low Young’s modulus (E) and high ultimate tensile strength (UTS) below 80 °C. The mechanism of brittle-ductile transition is discussed based on fracture surface observation results.
View Full-Text
Keywords:
tensile mechanical properties; S-S curves; sintered silver; porosity; fracture mechanism; reliability design
▼
Show Figures
Figure 1
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Wakamoto, K.; Mochizuki, Y.; Otsuka, T.; Nakahara, K.; Namazu, T. Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film. Materials 2020, 13, 4061. https://doi.org/10.3390/ma13184061
AMA Style
Wakamoto K, Mochizuki Y, Otsuka T, Nakahara K, Namazu T. Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film. Materials. 2020; 13(18):4061. https://doi.org/10.3390/ma13184061
Chicago/Turabian StyleWakamoto, Keisuke, Yo Mochizuki, Takukazu Otsuka, Ken Nakahara, and Takahiro Namazu. 2020. "Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film" Materials 13, no. 18: 4061. https://doi.org/10.3390/ma13184061
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
