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Journal: Materials, 2019
Volume: 12
Number: 936

Article: Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
Authors: by Min-Soo Kang, Do-Seok Kim and Young-Eui Shin
Link: https://www.mdpi.com/1996-1944/12/6/936

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