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Volume 11
Issue 8
10.3390/ma11081459
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Communication

CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant

by
Shuangyi Li
1,2,†,
Baosen Hou
1,3,†,
Dan Dai
1,*,
Shengcheng Shu
1,4,
Mingliang Wu
1,
Ao Li
1,4,
Yu Han
5,
Zhi-xiang Zhu
5,
Bao-an Chen
5,
Yi Ding
5,
Qiang Zhang
5,
Qiang Wang
6,
Nan Jiang
1 and
Cheng-Te Lin
1,4,*
1
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, China
2
School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China
3
College of Physics and Electronic Engineering, Sichuan Normal University, Chengdu 610101, China
4
University of Chinese Academy of Sciences, 19 A Yuquan Rd., Shijingshan District, Beijing 100049, China
5
State Key Laboratory of Advanced Transmission Technology, Global Energy Interconnection Research Institute Co., Ltd., Beijing 102209, China
6
State Grid Shanxi Electric Power Company, Taiyuan 030001, China
*
Authors to whom correspondence should be addressed.
†
These authors contribute equally to this work.
Materials 2018, 11(8), 1459; https://doi.org/10.3390/ma11081459
Received: 27 June 2018 / Revised: 27 July 2018 / Accepted: 2 August 2018 / Published: 17 August 2018
(This article belongs to the Special Issue Recent Advances in 2D Nanomaterials)
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Abstract

Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises difficulty of storage and handling of copper powder, particularly in the case of Cu microparticles. Here, we developed a thermal chemical vapor deposition chemical vapor deposition (CVD) process for large-scale synthesis of graphene coatings on Cu microparticles, which importantly can remain monodisperse without aggregation after graphene growth at high temperature by using removal spacers. Compared to other protective coating methods, the intrinsic electrical and thermal properties of Cu powder would not be degraded by uniform growth of low defect few-layer graphene on each particle surface. As a result, when the anticorrosion performance test was carried out by immersing the samples in Cu etchant, the corrosion rate of graphene/Cu microparticles was significantly improved (ca three times slower) compared to that of pristine Cu powder, also showing a comparable anticorrosion ability to commercial CuZn30 alloy. View Full-Text
Keywords: chemical vapor deposition (CVD) growth; graphene/Cu microparticles; removal spacers; monodisperse; corrosion resistance chemical vapor deposition (CVD) growth; graphene/Cu microparticles; removal spacers; monodisperse; corrosion resistance
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MDPI and ACS Style

Li, S.; Hou, B.; Dai, D.; Shu, S.; Wu, M.; Li, A.; Han, Y.; Zhu, Z.-x.; Chen, B.-a.; Ding, Y.; Zhang, Q.; Wang, Q.; Jiang, N.; Lin, C.-T. CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant. Materials 2018, 11, 1459. https://doi.org/10.3390/ma11081459

AMA Style

Li S, Hou B, Dai D, Shu S, Wu M, Li A, Han Y, Zhu Z-x, Chen B-a, Ding Y, Zhang Q, Wang Q, Jiang N, Lin C-T. CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant. Materials. 2018; 11(8):1459. https://doi.org/10.3390/ma11081459

Chicago/Turabian Style

Li, Shuangyi, Baosen Hou, Dan Dai, Shengcheng Shu, Mingliang Wu, Ao Li, Yu Han, Zhi-xiang Zhu, Bao-an Chen, Yi Ding, Qiang Zhang, Qiang Wang, Nan Jiang, and Cheng-Te Lin. 2018. "CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant" Materials 11, no. 8: 1459. https://doi.org/10.3390/ma11081459

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