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Open AccessArticle

Effects of Annealing on the Residual Stress in γ-TiAl Alloy by Molecular Dynamics Simulation

1
School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou 730050, China
2
Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education, Lanzhou University of Technology, Lanzhou 730050, China
*
Author to whom correspondence should be addressed.
Materials 2018, 11(6), 1025; https://doi.org/10.3390/ma11061025
Received: 21 May 2018 / Revised: 8 June 2018 / Accepted: 13 June 2018 / Published: 15 June 2018
In this paper, molecular dynamics simulations are performed to study the annealing process of γ-TiAl alloy with different parameters after introducing residual stress into prepressing. By mainly focusing on the dynamic evolution process of microdefects during annealing and the distribution of residual stress, the relationship between microstructure and residual stress is investigated. The results show that there is no phase transition during annealing, but atom distortion occurs with the change of temperature, and the average grain size slightly increases after annealing. There are some atom clusters in the grains, with a few point defects, and the point defect concentration increases with the rise in temperature, and vice versa; the higher the annealing temperature, the fewer the point defects in the grain after annealing. Due to the grain boundary volume shrinkage and and an increase in the plastic deformation of the grain boundaries during cooling, stress is released, and the average residual stress along Y and Z directions after annealing is less than the average residual stress after prepressing. View Full-Text
Keywords: residual stress; molecular dynamics; γ-TiAl alloy; anneal residual stress; molecular dynamics; γ-TiAl alloy; anneal
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Feng, R.; Song, W.; Li, H.; Qi, Y.; Qiao, H.; Li, L. Effects of Annealing on the Residual Stress in γ-TiAl Alloy by Molecular Dynamics Simulation. Materials 2018, 11, 1025.

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