Sun, F.; Li, C.; Fu, C.; Zhou, X.; Luo, J.; Zou, W.; Qiu, Z.-J.; Wu, D.
Tuning of Schottky Barrier Height at NiSi/Si Contact by Combining Dual Implantation of Boron and Aluminum and Microwave Annealing. Materials 2018, 11, 471.
https://doi.org/10.3390/ma11040471
AMA Style
Sun F, Li C, Fu C, Zhou X, Luo J, Zou W, Qiu Z-J, Wu D.
Tuning of Schottky Barrier Height at NiSi/Si Contact by Combining Dual Implantation of Boron and Aluminum and Microwave Annealing. Materials. 2018; 11(4):471.
https://doi.org/10.3390/ma11040471
Chicago/Turabian Style
Sun, Feng, Chen Li, Chaochao Fu, Xiangbiao Zhou, Jun Luo, Wei Zou, Zhi-Jun Qiu, and Dongping Wu.
2018. "Tuning of Schottky Barrier Height at NiSi/Si Contact by Combining Dual Implantation of Boron and Aluminum and Microwave Annealing" Materials 11, no. 4: 471.
https://doi.org/10.3390/ma11040471
APA Style
Sun, F., Li, C., Fu, C., Zhou, X., Luo, J., Zou, W., Qiu, Z.-J., & Wu, D.
(2018). Tuning of Schottky Barrier Height at NiSi/Si Contact by Combining Dual Implantation of Boron and Aluminum and Microwave Annealing. Materials, 11(4), 471.
https://doi.org/10.3390/ma11040471