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Journal: Materials, 2018
Volume: 11
Number: 2483

Article: Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers
Authors: by Katarzyna Placha, Richard S. Tuley, Milena Salvo, Valentina Casalegno and Kevin Simpson
Link: https://www.mdpi.com/1996-1944/11/12/2483

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