Juang, J.-Y.; Lu, C.-L.; Li, Y.-J.; Tu, K.N.; Chen, C.
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu. Materials 2018, 11, 2368.
https://doi.org/10.3390/ma11122368
AMA Style
Juang J-Y, Lu C-L, Li Y-J, Tu KN, Chen C.
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu. Materials. 2018; 11(12):2368.
https://doi.org/10.3390/ma11122368
Chicago/Turabian Style
Juang, Jing-Ye, Chia-Ling Lu, Yu-Jin Li, K. N. Tu, and Chih Chen.
2018. "Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu" Materials 11, no. 12: 2368.
https://doi.org/10.3390/ma11122368
APA Style
Juang, J.-Y., Lu, C.-L., Li, Y.-J., Tu, K. N., & Chen, C.
(2018). Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu. Materials, 11(12), 2368.
https://doi.org/10.3390/ma11122368