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Materials 2018, 11(12), 2394; https://doi.org/10.3390/ma11122394

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

1
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Osaka 5670047, Japan
2
The Institute of Scientific and Industrial Research, Osaka University, Osaka 5670047, Japan
*
Author to whom correspondence should be addressed.
Received: 31 October 2018 / Revised: 22 November 2018 / Accepted: 26 November 2018 / Published: 28 November 2018
(This article belongs to the Special Issue Material Interconnections and Microstructure Control-Related)
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Abstract

The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating. View Full-Text
Keywords: DBA; AMB; Ni electroplating; Ni–P electroless plating; cracking; grain boundary sliding; thermal shock test; roughness; metallization; reliability DBA; AMB; Ni electroplating; Ni–P electroless plating; cracking; grain boundary sliding; thermal shock test; roughness; metallization; reliability
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Choe, C.; Chen, C.; Noh, S.; Suganuma, K. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules. Materials 2018, 11, 2394.

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