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Open AccessLetter

Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation

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Department of Materials Physics, Montanuniversität Leoben, Jahnstrasse 12, 8700 Leoben, Austria
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Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria
*
Author to whom correspondence should be addressed.
Materials 2017, 10(11), 1287; https://doi.org/10.3390/ma10111287
Received: 4 September 2017 / Revised: 5 November 2017 / Accepted: 6 November 2017 / Published: 9 November 2017
Rapid progress in the reduction of substrate thickness for silicon-based microelectronics leads to a significant reduction of the device bending stiffness and the need to address its implication for the thermo-mechanical fatigue behavior of metallization layers. Results on 5 µm thick Cu films reveal a strong substrate thickness-dependent microstructural evolution. Substrates with hs = 323 and 220 µm showed that the Cu microstructure exhibits accelerated grain growth and surface roughening. Moreover, curvature-strain data indicates that Stoney’s simplified curvature-stress relation is not valid for thin substrates with regard to the expected strains, but can be addressed using more sophisticated plate bending theories. View Full-Text
Keywords: thin films; stress; thermo-mechanical thin films; stress; thermo-mechanical
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MDPI and ACS Style

Bigl, S.; Wurster, S.; Cordill, M.J.; Kiener, D. Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation. Materials 2017, 10, 1287.

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