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Materials 2017, 10(11), 1287;

Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation

Department of Materials Physics, Montanuniversität Leoben, Jahnstrasse 12, 8700 Leoben, Austria
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria
Author to whom correspondence should be addressed.
Received: 4 September 2017 / Revised: 5 November 2017 / Accepted: 6 November 2017 / Published: 9 November 2017
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Rapid progress in the reduction of substrate thickness for silicon-based microelectronics leads to a significant reduction of the device bending stiffness and the need to address its implication for the thermo-mechanical fatigue behavior of metallization layers. Results on 5 µm thick Cu films reveal a strong substrate thickness-dependent microstructural evolution. Substrates with hs = 323 and 220 µm showed that the Cu microstructure exhibits accelerated grain growth and surface roughening. Moreover, curvature-strain data indicates that Stoney’s simplified curvature-stress relation is not valid for thin substrates with regard to the expected strains, but can be addressed using more sophisticated plate bending theories. View Full-Text
Keywords: thin films; stress; thermo-mechanical thin films; stress; thermo-mechanical

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Bigl, S.; Wurster, S.; Cordill, M.J.; Kiener, D. Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation. Materials 2017, 10, 1287.

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