Next Article in Journal
Salt-Assisted Ultrasonicated De-Aggregation and Advanced Redox Electrochemistry of Detonation Nanodiamond
Previous Article in Journal
Effective Thermal Expansion Property of Consolidated Granular Materials
Open AccessLetter

Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation

Department of Materials Physics, Montanuniversität Leoben, Jahnstrasse 12, 8700 Leoben, Austria
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria
Author to whom correspondence should be addressed.
Materials 2017, 10(11), 1287;
Received: 4 September 2017 / Revised: 5 November 2017 / Accepted: 6 November 2017 / Published: 9 November 2017
Rapid progress in the reduction of substrate thickness for silicon-based microelectronics leads to a significant reduction of the device bending stiffness and the need to address its implication for the thermo-mechanical fatigue behavior of metallization layers. Results on 5 µm thick Cu films reveal a strong substrate thickness-dependent microstructural evolution. Substrates with hs = 323 and 220 µm showed that the Cu microstructure exhibits accelerated grain growth and surface roughening. Moreover, curvature-strain data indicates that Stoney’s simplified curvature-stress relation is not valid for thin substrates with regard to the expected strains, but can be addressed using more sophisticated plate bending theories. View Full-Text
Keywords: thin films; stress; thermo-mechanical thin films; stress; thermo-mechanical
Show Figures

Graphical abstract

MDPI and ACS Style

Bigl, S.; Wurster, S.; Cordill, M.J.; Kiener, D. Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney’s Equation. Materials 2017, 10, 1287.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

Back to TopTop