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Journal: Energies, 2016
Volume: 9
Number: 608
608
Article: Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration
Authors: by Luigi Ventola, Gabriele Curcuruto, Matteo Fasano, Saverio Fotia, Vincenzo Pugliese, Eliodoro Chiavazzo and Pietro Asinari
Link: https://www.mdpi.com/1996-1073/9/8/608

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