Lattice-Based Volumetric Heat Sinks for Forced-Convection Cooling of Power Electronics: A Critical Review

Lattice-based heat sinks have attracted increasing attention as volumetric thermal management architectures for forced-convection cooling of high-power electronic systems. In contrast to conventional plate-fin, pin-fin, and straight-channel configurations, lattice geometries promote three-dimensional flow–solid interaction through interconnected ligament networks that modify boundary-layer development, wake formation, and internal heat-spreading pathways. This review synthesizes recent experimental and numerical studies to examine the thermo-fluid mechanisms governing lattice performance, with emphasis on the coupled influence of porosity, ligament dimensions, topology, orientation, and channel confinement on heat-transfer enhancement and hydraulic resistance. The analysis indicates that while lattice structures can increase average Nusselt number and improve temperature uniformity, these gains are intrinsically linked to pressure-drop penalties associated with flow tortuosity and form drag, resulting in regime-dependent thermal-hydraulic behavior. Apparent discrepancies reported across the literature are frequently attributable to differences in geometric definition, Reynolds-number normalization, and boundary-condition specification rather than to inconsistencies in physical mechanisms. By consolidating geometric scaling, performance metrics, manufacturing considerations, and system-level constraints, this review clarifies the conditions under which lattice heat sinks may provide net benefit relative to conventional cooling technologies and identifies key research directions required to support application-relevant design and evaluation.