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Journal: Energies, 2024
Volume: 17
Number: 1127
Article:
Thermal Testing and System Reliability: Transferring Thermal Interactions by Heat Conduction through a Peltier-Based Thermal Coupling System
Authors:
by
Felix Leitenberger and Sven Matthiesen
Link:
https://www.mdpi.com/1996-1073/17/5/1127
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