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Journal: Energies, 2021
Volume: 14
Number: 2176
Article:
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Authors:
by
Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl and Alfred Binder
Link:
https://www.mdpi.com/1996-1073/14/8/2176
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