Chip Calorimetry for Single-Cell Analysis: Advances, Challenges, and Opportunities
Abstract
1. Introduction
1.1. Isothermal Titration Calorimetry
1.2. Differential Scanning Calorimetry
1.3. The Need for Miniaturization
2. Optical Chip Calorimeters
2.1. Infrared Thermography
2.2. Refractive Index Calorimetry
2.3. Liquid Expansion Calorimetry
2.4. Liquid Crystal Calorimetry
2.5. Fluorescence Calorimetry
2.6. Electroluminescence Calorimetry
2.7. Photothermal Biosensing
2.8. Design and Performance Considerations
3. Electrical Chip Calorimeters
3.1. Resistance-Based Chip Calorimeters
3.1.1. Thermistor-Based Chip Calorimeters
3.1.2. RTD-Based Chip Calorimeters
3.1.3. PN Junction-Based Chip Calorimeters
3.2. Thermocouple and Thermopile-Based Chip-Calorimeters
3.3. Design and Performance Considerations
4. Mechanical Chip Calorimeters
4.1. Static Mechanical Chip Calorimeters
- The heat is absorbed only at the end of the cantilever, resulting in a linear temperature profile;
- The heat is uniformly absorbed along the cantilever’s length, resulting in a parabolic temperature profile.
4.2. Dynamic Mechanical Chip Calorimeters
4.3. Design and Performance Considerations
5. Challenges
5.1. Insulation and Temperature Control
5.2. Sample Preparation and Sample Handling
5.3. Measurement Repeatability, Reproducibility, and Resolution
5.4. Fabrication, Throughput, and Commercial Use
6. Conclusions and Outlook
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
Abbreviations
| ITC | Isothermal Titration Calorimetry |
| DSC | Differential Scanning Calorimetry |
| TMDSC | Temperature Modulated Differential Scanning Calorimetry |
| µTAS | Micro Total Analysis Systems |
| IR | Infra-red |
| PCR | Polymerase Chain Reaction |
| LC | Liquid Crystal |
| ESR | Electron Spin Resonance |
| ODMR | Optically Detected Magnetic Resonance |
| QD | Quantum Dot |
| NV | Nitrogen Vacancy |
| OWiC | Optical Wireless-Integrated Circuit |
| PV | Photovoltaic |
| LED | Light Emitting Diode |
| LSPR | Localized Surface Plasmon Resonance |
| LFA | Lateral Flow Assay |
| NP | Nanoparticles |
| LOC | Lab-on-chip |
| RTD | Resistive Temperature Detector |
| TCR | Temperature Coefficient of Resistance |
| TFTC | Thin Film Thermocouple |
| SNR | Signal-to-Noise Ratio |
| BMC | Bimaterial Cantilever |
| TCRF | Temperature Coefficient of Resonant Frequency |
| SMR | Suspended Microchannel Resonator |
| SEM | Scanning Electron Microscope |
| PDMS | polydimethylsiloxane |
| PMMA | polymethylmethacrylate |
| VRC | Virtual Reaction Chamber |
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| Living Cell | Heat Power | Reference |
|---|---|---|
| Human lymphocytes | 5 pW | [27] |
| 3T3 mouse fibroblasts | 17 pW | |
| HeLa-53G | 31 pW | |
| Rat white adipocytes | 40 pW | |
| Human melanoma, H1477 | 80 pW | |
| Rat hepatocytes | 102 pW | [28] |
| Kidney cell | 0.3 nW | [29] |
| Neuron cell | 0.3 nW | |
| Amoeba | 1.3 nW | |
| Stimulated muscle cell | 2.3 nW | |
| Stimulated myocardial cell | 2.8 nW | |
| Stimulated brown fat cell | 3 nW | |
| Tetrahymena | 3.1 nW |
| References | Year | Thermometry | TCR (K−1) | Insulation by Suspension |
Liquid
Samples | Temperature Resolution |
Power
Resolution | |
|---|---|---|---|---|---|---|---|---|
| Type | Materials | |||||||
| [82] | 1995 | Thermistor | Doped Polysilicon | −1.7% | No | Yes | 5000 μK * | 200 μW * |
| [84] ◊ | 2004 | n+ Amorphous Silicon | 2.8% | Yes | Yes | 500 µK | 2 μW * | |
| [85,86] ◊ | 2008–2009 | Vox | 2.7% | Yes | Yes | 60 µK | 60 nW | |
| [83] | 2011 | B+ Polysilicon | 0.07% | Yes | Yes | 200 μK * | 5 nW * | |
| [77,79,89,90,93] | 2016–2022 | Vox | −(2.5–2.8)% | Yes | Yes | 60 µK | 40 nW | |
| [87] | 2016 | Vox | −2.2% | Yes | Yes | 50 µK | 570 pW | |
| [88] | 2017 | Vox | −1.3% | Yes | Yes | 1000 μK | 75 nW * | |
| [91] | 2020 | Vox | −3.4% | Yes | Yes | 400 µK | 5 nW * | |
| [105] ¤ | 2014 | RTDs | NbNx | 0.67% | Yes | No | 250 μK * | 1.5 pW * |
| [96] | 2014 | Ni | 0.11% | No | Yes | 25,000 μK □ | 5 μW □ | |
| [100,101] | 2014–2020 | Al | 0.315% | Yes | Yes | 150 µK | 40 nW | |
| [106] | 2016 | PN Junction | n SOI wafer and B+ Si | 1.4% | Yes | Yes | 1100 μK | 75 nW |
| Materials | Seebeck Coefficient (µV/K) |
|---|---|
| Si | 440 |
| Cr | 21.8 |
| Ni | −15 |
| Al | 3.5 |
| W | 7.5 |
| Pb | 4 |
| Cu | 6.5 |
| Bi | −72 |
| Ti | 1 |
| Au | 6.5 |
| Pt | 0 |
| Pd | 11 |
| Constantan | −35 |
| Nichrome | 25 |
| Reference | Year | Materials | Insulation by Suspension | Liquid Samples | Responsivity (V/W) | Power Resolution |
|---|---|---|---|---|---|---|
| [127] | 1993 | Al/P-type Silicon | Yes | Yes | 1 | 0.2–0.4 µW |
| [128] | 1994 | Al/Si | Yes | Yes | 8 | 25 nW * |
| [129,131] | 2000–2007 | Al/p+ Polysilicon | Yes | Yes | 7 | 25 nW * |
| [123,124,125] | 2002–2004 | Au/Ni | Yes | Yes | 2 | 10–25 nW |
| [117] | 2004 | Au/B+ Polysilicon | Yes | Yes | 1 | 250 nW * |
| [5,135,136,137,138,140,141,143,145,146,147,149,150,151,152] | 2005 | BiSb/Sb | Yes | Yes | 8 | 50 nW |
| [73,116] | 2008 | Cr/Ni | Yes | Yes | 1 | 360 nW * |
| [132] | 2009 | Al/Polysilicon | Yes | No | 2430 | 3.4 µW |
| [126] | 2009 | Au/Ni | Yes | Yes | 7 | 4 nW |
| [113] | 2009 | p Polysilicon/n Polysilicon | Yes | Yes | 11 | 200 nW |
| [158] | 2011 | p Polysilicon/n Polysilicon | Yes | Yes | 5 | 500 nW * |
| [71,74,144] | 2012–2015 | Bi/Sb | Yes | Yes | 8 | 10 nW * |
| [148] | 2015 | Bi/Sb | No | Yes | 5 | 20 nW |
| [121] | 2017 | Bi/Ti | Yes | Yes | 7 | 10 nW * |
| [122] | 2019 | Bi/Ti | Yes | Yes | 45 | 1 nW * |
| [8] | 2019 | Bi/Sb | No | Yes | 5 | 20 nW * |
| [154] | 2020 | Bi/Sb | Yes | Yes | 5 | 50 nW |
| [167] | 2025 | Bi2Te3 | No | Yes | 1 | 5 μW |
| Reference | Year | Type | Liquid Samples | Responsivity | Resolution |
|---|---|---|---|---|---|
| [176,177] | 1994 | Static | No | 0.18 Å/nW | 100 pW |
| [180,183,184] | 2010–2016 | No | 0.09 Å/nW * | 200 pW * | |
| [181] ¤ | 2011 | No | 2.5 Å/nW * | 4 pW | |
| [189] ¤ | 2024 | No | 35 Å/nW * | 100 pW | |
| [191,192,193] | 2012–2016 | Dynamic | Yes | −77 ppm/nW * | 70–80 nW * |
|
Optical Chip Calorimeters |
Electrical Chip Calorimeters |
Mechanical Chip Calorimeters | |
|---|---|---|---|
| Advantages |
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| Limitations |
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Abdelaal, Y.; Villanueva, L.G. Chip Calorimetry for Single-Cell Analysis: Advances, Challenges, and Opportunities. Sensors 2026, 26, 2193. https://doi.org/10.3390/s26072193
Abdelaal Y, Villanueva LG. Chip Calorimetry for Single-Cell Analysis: Advances, Challenges, and Opportunities. Sensors. 2026; 26(7):2193. https://doi.org/10.3390/s26072193
Chicago/Turabian StyleAbdelaal, Yara, and Luis Guillermo Villanueva. 2026. "Chip Calorimetry for Single-Cell Analysis: Advances, Challenges, and Opportunities" Sensors 26, no. 7: 2193. https://doi.org/10.3390/s26072193
APA StyleAbdelaal, Y., & Villanueva, L. G. (2026). Chip Calorimetry for Single-Cell Analysis: Advances, Challenges, and Opportunities. Sensors, 26(7), 2193. https://doi.org/10.3390/s26072193
