Al-Mahmodi, M.; Al-Zanina, M.; Al-Haidari, R.; Takakuwa, M.; Yamamoto, M.; Poliks, M.D.; Takamatsu, S.
Low-Temperature and Room-Temperature Surface-Activated Au–Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications. Sensors 2026, 26, 5939.
https://doi.org/10.3390/s26185939
AMA Style
Al-Mahmodi M, Al-Zanina M, Al-Haidari R, Takakuwa M, Yamamoto M, Poliks MD, Takamatsu S.
Low-Temperature and Room-Temperature Surface-Activated Au–Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications. Sensors. 2026; 26(18):5939.
https://doi.org/10.3390/s26185939
Chicago/Turabian Style
Al-Mahmodi, Mohammed, Mousa Al-Zanina, Riadh Al-Haidari, Masahito Takakuwa, Michitaka Yamamoto, Mark D. Poliks, and Seiichi Takamatsu.
2026. "Low-Temperature and Room-Temperature Surface-Activated Au–Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications" Sensors 26, no. 18: 5939.
https://doi.org/10.3390/s26185939
APA Style
Al-Mahmodi, M., Al-Zanina, M., Al-Haidari, R., Takakuwa, M., Yamamoto, M., Poliks, M. D., & Takamatsu, S.
(2026). Low-Temperature and Room-Temperature Surface-Activated Au–Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications. Sensors, 26(18), 5939.
https://doi.org/10.3390/s26185939
