Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints
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Mauersberger, V.W.; Senf, B.; Menzel, S. Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints. Sensors 2026, 26, 3738. https://doi.org/10.3390/s26123738
Mauersberger VW, Senf B, Menzel S. Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints. Sensors. 2026; 26(12):3738. https://doi.org/10.3390/s26123738
Chicago/Turabian StyleMauersberger, Valentin Wilhelm, Björn Senf, and Sandra Menzel. 2026. "Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints" Sensors 26, no. 12: 3738. https://doi.org/10.3390/s26123738
APA StyleMauersberger, V. W., Senf, B., & Menzel, S. (2026). Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints. Sensors, 26(12), 3738. https://doi.org/10.3390/s26123738

