Rwei, P.; Shiu, J.-W.; Senel, M.; Hajiaghajani, A.; Qian, C.; Chen, C.-W.; Tseng, P.; Khine, M.
A Waterborne, Flexible, and Highly Conductive Silver Ink for Ultra-Rapid Fabrication of Epidermal Electronics. Sensors 2025, 25, 2092.
https://doi.org/10.3390/s25072092
AMA Style
Rwei P, Shiu J-W, Senel M, Hajiaghajani A, Qian C, Chen C-W, Tseng P, Khine M.
A Waterborne, Flexible, and Highly Conductive Silver Ink for Ultra-Rapid Fabrication of Epidermal Electronics. Sensors. 2025; 25(7):2092.
https://doi.org/10.3390/s25072092
Chicago/Turabian Style
Rwei, Patrick, Jia-Wei Shiu, Mehmet Senel, Amirhossein Hajiaghajani, Chengyang Qian, Chin-Wen Chen, Peter Tseng, and Michelle Khine.
2025. "A Waterborne, Flexible, and Highly Conductive Silver Ink for Ultra-Rapid Fabrication of Epidermal Electronics" Sensors 25, no. 7: 2092.
https://doi.org/10.3390/s25072092
APA Style
Rwei, P., Shiu, J.-W., Senel, M., Hajiaghajani, A., Qian, C., Chen, C.-W., Tseng, P., & Khine, M.
(2025). A Waterborne, Flexible, and Highly Conductive Silver Ink for Ultra-Rapid Fabrication of Epidermal Electronics. Sensors, 25(7), 2092.
https://doi.org/10.3390/s25072092