Order Article Reprints

Du J, Zhao X, Su J, Li B, Duan X, Dong T, Lin H, Ren Y, Miao Y, Radamson HH. Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. Sensors. 2025; 25(1):263. https://doi.org/10.3390/s25010263

Du, Junhao, Xuewei Zhao, Jiale Su, Ben Li, Xiangliang Duan, Tianyu Dong, Hongxiao Lin, Yuhui Ren, Yuanhao Miao, and Henry H. Radamson. 2025. "Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology" Sensors 25, no. 1: 263. https://doi.org/10.3390/s25010263

Du, J., Zhao, X., Su, J., Li, B., Duan, X., Dong, T., Lin, H., Ren, Y., Miao, Y., & Radamson, H. H. (2025). Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. Sensors, 25(1), 263. https://doi.org/10.3390/s25010263