Wu, H.; Zhang, Y.; Jia, Q.; Cao, H.; Li, H.; Ma, M.
Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. Sensors 2025, 25, 107.
https://doi.org/10.3390/s25010107
AMA Style
Wu H, Zhang Y, Jia Q, Cao H, Li H, Ma M.
Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. Sensors. 2025; 25(1):107.
https://doi.org/10.3390/s25010107
Chicago/Turabian Style
Wu, Hongjian, Ya’nan Zhang, Qingjian Jia, Hui Cao, Han Li, and Ming Ma.
2025. "Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer" Sensors 25, no. 1: 107.
https://doi.org/10.3390/s25010107
APA Style
Wu, H., Zhang, Y., Jia, Q., Cao, H., Li, H., & Ma, M.
(2025). Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. Sensors, 25(1), 107.
https://doi.org/10.3390/s25010107