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Journal: Sensors, 2022
Volume: 22
Number: 2814
Article:
Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Authors:
by
Stijn Wielandt, Sebastian Uhlemann, Sylvain Fiolleau and Baptiste Dafflon
Link:
https://www.mdpi.com/1424-8220/22/7/2814
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