Matsumae, T.; Kariya, S.; Kurashima, Y.; Thu, L.H.H.; Higurashi, E.; Hayase, M.; Takagi, H.
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors 2022, 22, 8144.
https://doi.org/10.3390/s22218144
AMA Style
Matsumae T, Kariya S, Kurashima Y, Thu LHH, Higurashi E, Hayase M, Takagi H.
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors. 2022; 22(21):8144.
https://doi.org/10.3390/s22218144
Chicago/Turabian Style
Matsumae, Takashi, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, and Hideki Takagi.
2022. "Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging" Sensors 22, no. 21: 8144.
https://doi.org/10.3390/s22218144
APA Style
Matsumae, T., Kariya, S., Kurashima, Y., Thu, L. H. H., Higurashi, E., Hayase, M., & Takagi, H.
(2022). Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. Sensors, 22(21), 8144.
https://doi.org/10.3390/s22218144