Bao, J.; Maenhout, G.; Markovic, T.; Ocket, I.; Nauwelaers, B.
A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications. Sensors 2020, 20, 1687.
https://doi.org/10.3390/s20061687
AMA Style
Bao J, Maenhout G, Markovic T, Ocket I, Nauwelaers B.
A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications. Sensors. 2020; 20(6):1687.
https://doi.org/10.3390/s20061687
Chicago/Turabian Style
Bao, Juncheng, Gertjan Maenhout, Tomislav Markovic, Ilja Ocket, and Bart Nauwelaers.
2020. "A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications" Sensors 20, no. 6: 1687.
https://doi.org/10.3390/s20061687
APA Style
Bao, J., Maenhout, G., Markovic, T., Ocket, I., & Nauwelaers, B.
(2020). A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications. Sensors, 20(6), 1687.
https://doi.org/10.3390/s20061687