Second Generation Small Pixel Technology Using Hybrid Bond Stacking†
OmniVision Technologies, Inc., Santa Clara, CA 95054, USA
*
Author to whom correspondence should be addressed.
†
This paper is an extended version of our paper published in Venezia, V.C.; Shih, C.; Yang,W.-Z.; Zang, Y.; Lin, Z.; Grant, L.A.; Rhodes, H. 1.0 m pixel improvements with hybrid bond stacking technology. In Proceedings of the International Image Sensor Workshop, Hiroshima, Japan, 30 May–2 June 2017; pp. 8–11.
Sensors 2018, 18(2), 667; https://doi.org/10.3390/s18020667
Received: 2 November 2017 / Revised: 26 January 2018 / Accepted: 13 February 2018 / Published: 24 February 2018
(This article belongs to the Special Issue Special Issue on the 2017 International Image Sensor Workshop (IISW))
In this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 µm pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology.
View Full-Text
▼
Show Figures
Figure 1
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Venezia, V.C.; Hsiung, A.C.-W.; Yang, W.-Z.; Zhang, Y.; Zhao, C.; Lin, Z.; Grant, L.A. Second Generation Small Pixel Technology Using Hybrid Bond Stacking. Sensors 2018, 18, 667. https://doi.org/10.3390/s18020667
AMA Style
Venezia VC, Hsiung AC-W, Yang W-Z, Zhang Y, Zhao C, Lin Z, Grant LA. Second Generation Small Pixel Technology Using Hybrid Bond Stacking. Sensors. 2018; 18(2):667. https://doi.org/10.3390/s18020667
Chicago/Turabian StyleVenezia, Vincent C.; Hsiung, Alan C.-W.; Yang, Wu-Zang; Zhang, Yuying; Zhao, Cheng; Lin, Zhiqiang; Grant, Lindsay A. 2018. "Second Generation Small Pixel Technology Using Hybrid Bond Stacking" Sensors 18, no. 2: 667. https://doi.org/10.3390/s18020667
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
Search more from Scilit
