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Sensors 2016, 16(2), 198;

Active C4 Electrodes for Local Field Potential Recording Applications

Department of Electrical and Computer Engineering, Boston University, 8 Saint Mary’s St, Boston 02215, MA, USA
Department of Biomedical Engineering, New Jersey Institute of Technology, 323 Martin Luther King, Jr. Boulevard, University Heights Newark, Newark 07102, NJ, USA
Department of Biomedical Engineering, Boston University, 44 Cummington St, Boston 02215, MA, USA
Author to whom correspondence should be addressed.
Academic Editor: Alexander Star
Received: 8 December 2015 / Revised: 26 January 2016 / Accepted: 31 January 2016 / Published: 4 February 2016
(This article belongs to the Section Biosensors)
Full-Text   |   PDF [2966 KB, uploaded 4 February 2016]   |  


Extracellular neural recording, with multi-electrode arrays (MEAs), is a powerful method used to study neural function at the network level. However, in a high density array, it can be costly and time consuming to integrate the active circuit with the expensive electrodes. In this paper, we present a 4 mm × 4 mm neural recording integrated circuit (IC) chip, utilizing IBM C4 bumps as recording electrodes, which enable a seamless active chip and electrode integration. The IC chip was designed and fabricated in a 0.13 μm BiCMOS process for both in vitro and in vivo applications. It has an input-referred noise of 4.6 μV rms for the bandwidth of 10 Hz to 10 kHz and a power dissipation of 11.25 mW at 2.5 V, or 43.9 μW per input channel. This prototype is scalable for implementing larger number and higher density electrode arrays. To validate the functionality of the chip, electrical testing results and acute in vivo recordings from a rat barrel cortex are presented. View Full-Text
Keywords: 3D electrodes; C4; CMOS; extracellular; in vitro; in vivo; MEA; neural sensors 3D electrodes; C4; CMOS; extracellular; in vitro; in vivo; MEA; neural sensors

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Wang, L.; Freedman, D.; Sahin, M.; Ünlü, M.S.; Knepper, R. Active C4 Electrodes for Local Field Potential Recording Applications. Sensors 2016, 16, 198.

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