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Electrothermally-Actuated Micromirrors with Bimorph Actuators—Bending-Type and Torsion-Type

Graduate Institute of Photonics and Optoelectronics and the Department of Electrical Engineering, National Taiwan University, Taipei 10617, Taiwan
*
Author to whom correspondence should be addressed.
These authors contributed equally to this work.
Academic Editor: Stefano Mariani
Sensors 2015, 15(6), 14745-14756; https://doi.org/10.3390/s150614745
Received: 31 March 2015 / Revised: 12 May 2015 / Accepted: 13 May 2015 / Published: 22 June 2015
(This article belongs to the Section Physical Sensors)
Three different electrothermally-actuated MEMS micromirrors with Cr/Au-Si bimorph actuators are proposed. The devices are fabricated with the SOIMUMPs process developed by MEMSCAP, Inc. (Durham, NC, USA). A silicon-on-insulator MEMS process has been employed for the fabrication of these micromirrors. Electrothermal actuation has achieved a large angular movement in the micromirrors. Application of an external electric current 0.04 A to the bending-type, restricted-torsion-type, and free-torsion-type mirrors achieved rotation angles of 1.69°, 3.28°, and 3.64°, respectively. View Full-Text
Keywords: microelectromechanical devices; electrothermal effects; silicon on insulator microelectromechanical devices; electrothermal effects; silicon on insulator
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MDPI and ACS Style

Tsai, C.-H.; Tsai, C.-W.; Chang, H.-T.; Liu, S.-H.; Tsai, J.-C. Electrothermally-Actuated Micromirrors with Bimorph Actuators—Bending-Type and Torsion-Type. Sensors 2015, 15, 14745-14756. https://doi.org/10.3390/s150614745

AMA Style

Tsai C-H, Tsai C-W, Chang H-T, Liu S-H, Tsai J-C. Electrothermally-Actuated Micromirrors with Bimorph Actuators—Bending-Type and Torsion-Type. Sensors. 2015; 15(6):14745-14756. https://doi.org/10.3390/s150614745

Chicago/Turabian Style

Tsai, Cheng-Hua; Tsai, Chun-Wei; Chang, Hsu-Tang; Liu, Shih-Hsiang; Tsai, Jui-Che. 2015. "Electrothermally-Actuated Micromirrors with Bimorph Actuators—Bending-Type and Torsion-Type" Sensors 15, no. 6: 14745-14756. https://doi.org/10.3390/s150614745

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