Boscarino, S.;                     Iacono, V.;                     Lo Mastro, A.;                     Tringali, F.;                     Terrasi, A.;                     Grimaldi, M.G.;                     Ruffino, F.    
        Plasmonic and Conductive Structures of TCO Films with Embedded Cu Nanoparticles. Int. J. Mol. Sci. 2022, 23, 11886.
    https://doi.org/10.3390/ijms231911886
    AMA Style
    
                                Boscarino S,                                 Iacono V,                                 Lo Mastro A,                                 Tringali F,                                 Terrasi A,                                 Grimaldi MG,                                 Ruffino F.        
                Plasmonic and Conductive Structures of TCO Films with Embedded Cu Nanoparticles. International Journal of Molecular Sciences. 2022; 23(19):11886.
        https://doi.org/10.3390/ijms231911886
    
    Chicago/Turabian Style
    
                                Boscarino, Stefano,                                 Valentina Iacono,                                 Andrea Lo Mastro,                                 Fiorella Tringali,                                 Antonio Terrasi,                                 Maria Grazia Grimaldi,                                 and Francesco Ruffino.        
                2022. "Plasmonic and Conductive Structures of TCO Films with Embedded Cu Nanoparticles" International Journal of Molecular Sciences 23, no. 19: 11886.
        https://doi.org/10.3390/ijms231911886
    
    APA Style
    
                                Boscarino, S.,                                 Iacono, V.,                                 Lo Mastro, A.,                                 Tringali, F.,                                 Terrasi, A.,                                 Grimaldi, M. G.,                                 & Ruffino, F.        
        
        (2022). Plasmonic and Conductive Structures of TCO Films with Embedded Cu Nanoparticles. International Journal of Molecular Sciences, 23(19), 11886.
        https://doi.org/10.3390/ijms231911886