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Termite Resistance of MDF Panels Treated with Various Boron Compounds

1
Karadeniz Technical University, Faculty of Forestry, Trabzon, Turkey
2
Istanbul University, Faculty of Forestry, Istanbul, Turkey
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Author to whom correspondence should be addressed.
Int. J. Mol. Sci. 2009, 10(6), 2789-2797; https://doi.org/10.3390/ijms10062789
Received: 8 May 2009 / Revised: 10 June 2008 / Accepted: 15 June 2009 / Published: 19 June 2009
(This article belongs to the Section Biochemistry)
In this study, the effects of various boron compounds on the termite resistance of MDF panels were evaluated. Either borax (BX), boric acid (BA), zinc borate (ZB), or sodium perborate tetrahydrate (SPT) were added to urea-formaldehyde (UF) resin at target contents of 1%, 1.5%, 2% and 2.5% based on dry fiber weight. The panels were then manufactured using 12% urea-formaldehyde resin and 1% NH4Cl. MDF samples from the panels were tested against the subterranean termites, Coptotermes formosanus Shiraki. Laboratory termite resistance tests showed that all samples containing boron compounds had greater resistance against termite attack compared to untreated MDF samples. At the second and third weeks of exposure, nearly 100% termite mortalities were recorded in all boron compound treated samples. The highest termite mortalities were determined in the samples with either BA or BX. Also, it was found that SPT showed notable performance on the termite mortality. As chemical loadings increased, termite mortalities increased, and at the same time the weight losses of the samples decreased. View Full-Text
Keywords: medium density fiberboard (MDF); termite resistance; borax; boric acid; zinc borate; sodium perborate tetrahydrate; Coptotermes formosanus Shiraki medium density fiberboard (MDF); termite resistance; borax; boric acid; zinc borate; sodium perborate tetrahydrate; Coptotermes formosanus Shiraki
MDPI and ACS Style

Usta, M.; Ustaomer, D.; Kartal, S.N.; Ondaral, S. Termite Resistance of MDF Panels Treated with Various Boron Compounds. Int. J. Mol. Sci. 2009, 10, 2789-2797.

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