Wei, Y.; Dai, H.; Chen, L.; Wang, X.; Cai, H.; Zhang, J.; Xu, Y.; Wang, X.; Guo, J.; Yuan, Z.;
et al. First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder. Molecules 2024, 29, 4171.
https://doi.org/10.3390/molecules29174171
AMA Style
Wei Y, Dai H, Chen L, Wang X, Cai H, Zhang J, Xu Y, Wang X, Guo J, Yuan Z,
et al. First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder. Molecules. 2024; 29(17):4171.
https://doi.org/10.3390/molecules29174171
Chicago/Turabian Style
Wei, Yan, Hua Dai, Li Chen, Xian Wang, Hongzhong Cai, Jiankang Zhang, Ying Xu, Xingqiang Wang, Junmei Guo, Zhentao Yuan,
and et al. 2024. "First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder" Molecules 29, no. 17: 4171.
https://doi.org/10.3390/molecules29174171
APA Style
Wei, Y., Dai, H., Chen, L., Wang, X., Cai, H., Zhang, J., Xu, Y., Wang, X., Guo, J., Yuan, Z., & Wang, X.
(2024). First Principles Calculation of the Effect of Cu Doping on the Mechanical and Thermodynamic Properties of Au-2.0Ni Solder. Molecules, 29(17), 4171.
https://doi.org/10.3390/molecules29174171
