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Journal: Molecules, 2021
Volume: 26
Number: 2240
Article:
In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage
Authors:
by
Satoshi Horikoshi, Yuhei Arai and Nick Serpone
Link:
https://www.mdpi.com/1420-3049/26/8/2240
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