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Open AccessArticle

Copper Nanoparticles Mediated by Chitosan: Synthesis and Characterization via Chemical Methods

1
Department of Chemistry, Faculty of Science, Universiti Putra Malaysia, UPM Serdang, Selangor 43400, Malaysia
2
Materials and Energy Research Centre, Karaj 317-798-3634, Iran
3
Department of Chemistry, Faculty of Defence Science and Technology, National Defence University of Malaysia, 57000 Kuala Lumpur, Malaysia
*
Authors to whom correspondence should be addressed.
Molecules 2012, 17(12), 14928-14936; https://doi.org/10.3390/molecules171214928
Received: 26 October 2012 / Revised: 12 November 2012 / Accepted: 21 November 2012 / Published: 14 December 2012
Herein we report a synthesis of copper nanoparticles (Cu-NPs) in chitosan (Cts) media via a chemical reaction method. The nanoparticles were synthesized in an aqueous solution in the presence of Cts as stabilizer and CuSO4·5H2O precursor. The synthesis proceeded with addition of NaOH as pH moderator, ascorbic acid as antioxidant and hydrazine as the reducing agent. The characterization of the prepared NPs was done using ultraviolet-visible spectroscopy, which showed a 593 nm copper band. The Field Emission Scanning Electron Microscope (FESEM) images were also observed, and found to be in agreement with the UV-Vis result, confirming the formation of metallic Cu-NPs. The mean size of the Cu-NPs was estimated to be in the range of 35–75 nm using X-ray diffraction. XRD was also used in analysis of the crystal structure of the NPs. The interaction between the chitosan and the synthesized NPs was studied using Fourier transform infrared (FT-IR) spectroscopy, which showed the capping of the NPs by Cts. View Full-Text
Keywords: chitosan; copper sulphate; copper nanoparticle; chemical reduction method chitosan; copper sulphate; copper nanoparticle; chemical reduction method
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Usman, M.S.; Ibrahim, N.A.; Shameli, K.; Zainuddin, N.; Yunus, W.M.Z.W. Copper Nanoparticles Mediated by Chitosan: Synthesis and Characterization via Chemical Methods. Molecules 2012, 17, 14928-14936.

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