Additive Manufacturing of High-Entropy Alloys: A Review
AbstractOwing to the reduced defects, low cost, and high efficiency, the additive manufacturing (AM) technique has attracted increasingly attention and has been applied in high-entropy alloys (HEAs) in recent years. It was found that AM-processed HEAs possess an optimized microstructure and improved mechanical properties. However, no report has been proposed to review the application of the AM method in preparing bulk HEAs. Hence, it is necessary to introduce AM-processed HEAs in terms of applications, microstructures, mechanical properties, and challenges to provide readers with fundamental understanding. Specifically, we reviewed (1) the application of AM methods in the fabrication of HEAs and (2) the post-heat treatment effect on the microstructural evolution and mechanical properties. Compared with the casting counterparts, AM-HEAs were found to have a superior yield strength and ductility as a consequence of the fine microstructure formed during the rapid solidification in the fabrication process. The post-treatment, such as high isostatic pressing (HIP), can further enhance their properties by removing the existing fabrication defects and residual stress in the AM-HEAs. Furthermore, the mechanical properties can be tuned by either reducing the pre-heating temperature to hinder the phase partitioning or modifying the composition of the HEA to stabilize the solid-solution phase or ductile intermetallic phase in AM materials. Moreover, the processing parameters, fabrication orientation, and scanning method can be optimized to further improve the mechanical performance of the as-built-HEAs. View Full-Text
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Chen, S.; Tong, Y.; Liaw, P.K. Additive Manufacturing of High-Entropy Alloys: A Review. Entropy 2018, 20, 937.
Chen S, Tong Y, Liaw PK. Additive Manufacturing of High-Entropy Alloys: A Review. Entropy. 2018; 20(12):937.Chicago/Turabian Style
Chen, Shuying; Tong, Yang; Liaw, Peter K. 2018. "Additive Manufacturing of High-Entropy Alloys: A Review." Entropy 20, no. 12: 937.
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