Search Results (6)

This study investigates a metal-contact etching process that differs from conventional device contact etching by focusing on the film-stack configuration and the associated super-contact etching characteristics. Because metal-contact etching is closely linked to both physical profiles and electrical performance, evaluating a single parameter provides limited insight; thus, the physical profile characteristics of metal-contact etching and 3D-integrated super-contacts were comprehensively examined. In the first-step etch, the target depth in the wafer left region was approximately 2365 Å, and the bottom surface exhibited a desirable rounded profile. Following the removal of liner TEOS and nitride, the stopping margin was evaluated under three conditions: (1) metal-contact etching with a ~22 s target reduction, (2) a CMOS image-sensor baseline incorporating an interlayer-dielectric-reduction scheme, and (3) a high-selectivity condition achieved by increasing the C₅F₈/O₂ ratio with a reduced etch target. Under all three conditions, the bit-line contact (BLC) nitride experienced punch-through. To address this limitation, a three-step etch sequence was implemented, in which the first two steps achieved the required etch depth and the final step utilized a high-selectivity over-etch to secure a sufficient stopping margin. This approach demonstrated robust process windows, favorable CD control, and reliable nitride stopping performance, thereby establishing a practical methodology for stable super-contact etching in advanced 3D-integrated logic applications. Full article

With the significant growth in modern computing systems, dynamic random access memory (DRAM) has become a power/performance/energy bottleneck in data-intensive applications. Both the power management mechanism and downscaling method face decreasing performance or difficulties in the smaller footprint of the DRAM capacitor. Since optimizing the circuit of sense amplifier (SA) is an efficient method to reduce energy consumption, we propose two single bitline load sense amplifier (SBLSA) circuits, i.e., a redundant voltage discharged SBLSA (RVD-SBLSA) circuit and a bit aware SBLSA (BA-SBLSA) circuit, to improve conventional and single bitline write (SBW) circuits. The RVD-SBLSA circuit utilizes a clamp diode to discharge redundant voltage over VDD/2 with an additional working stage. The BA-SBLSA circuit abandons the single bitline load (SBL) circuit during read and write ‘1’ operations. The RVD-SBLSA circuit can offer the lowest total energy consumption, and the BA-SBLSA circuit can make a better balance between energy consumption and latency. Through the simulation results, the proposed circuits can efficiently reduce energy consumption or balance energy consumption and latency and show huge potentials in very large-scale integrated circuits. Full article

Spin-transfer torque magnetic random-access memory (STT-MRAM) has several desirable features, such as non-volatility, high integration density, and near-zero leakage power. However, it is challenging to adopt STT-MRAM in a wide range of memory applications owing to the long write latency and a tradeoff between read stability and write ability. To mitigate these issues, an STT-MRAM bit cell can be designed with two transistors to support multiple ports, as well as the independent optimization of read stability and write ability. The multi-port STT-MRAM, however, is achieved at the expense of a higher area requirement due to an additional transistor per cell. In this work, we propose an area-efficient design of 1R/1W dual-port STT-MRAM that shares a bitline between two adjacent bit cells. We identify that the bitline sharing may cause simultaneous access conflicts, which can be effectively alleviated by using the bit-interleaving architecture with a long interleaving distance and the sufficient number of word lines per memory bank. We report various metrics of the proposed design based on the bit cell design using a 45 nm process. Compared to a standard single-port STT-MRAM, the proposed design shows a 15% lower read power and a 19% higher read-disturb margin. Compared with prior work on the 1R/1W dual-port STT-MRAM, the proposed design improves the area by 25%. Full article

This paper describes pre-emphasis (PE) pulses to reduce bit-line (BL) access time in NAND flash memory. Optimum PE pulse widths and resultant minimum BL delay times are investigated, where the BL delay is determined by the sense current at the input terminal of a sensing circuit in contrast with the word-line (WL) delay that is determined by the WL voltage at the gate of a selected memory cell. Two BL models are used, namely, a single-line model (SLM) for the shielded BL read operation and a three-line model (TLM) for the all-BL read operation. Under the condition that the sense current delay is defined by the time when the sense current becomes stable between 110% and 90% of the cell current and the BL voltage delay is defined by the time when the BL voltage at the selected cell reaches a window between 110% and 90%, SPICE simulation results show that the sensed current delay and the BL voltage delay are reduced by 43% and 36% in the case of SLM and by 16% and 28% in the case of TLM, respectively. Thus, the key results are the following: (1) PE pulses are effective to reduce the sense current delay time for BL access, as well as the BL voltage delay time for both SLM and TLM; (2) the sensitivity of the PE pulse on the delay time is much larger for the sensed current delay than the BL voltage delay due to the absence of filtering with the RC delay element in BL delay; and (3) address-dependent PE pulse control can reduce the sense current delay significantly, especially for access to cells closely located to the sensing circuit. Full article

We propose a novel ultra-low-power, voltage-based compute-in-memory (CIM) design with a new single-ended 8T SRAM bit cell structure. Since the proposed SRAM bit cell uses a single bitline for CIM calculation with decoupled read and write operations, it supports a much higher energy efficiency. In addition, to separate read and write operations, the stack structure of the read unit minimizes leakage power consumption. Moreover, the proposed bit cell structure provides better read and write stability due to the isolated read path, write path and greater pull-up ratio. Compared to the state-of-the-art SRAM-CIM, our proposed SRAM-CIM does not require extra transistors for CIM vector-matrix multiplication. We implemented a 16 k (128 × 128) bit cell array for the computation of 128× neurons, and used 64× binary inputs (0 or 1) and 64 × 128 binary weights (−1 or +1) values for the binary neural networks (BNNs). Each row of the bit cell array corresponding to a single neuron consists of a total of 128 cells, 64× cells for dot-product and 64× replicas cells for ADC reference. Additionally, 64× replica cells consist of 32× cells for ADC reference and 32× cells for offset calibration. We used a row-by-row ADC for the quantized outputs of each neuron, which supports 1–7 bits of output for each neuron. The ADC uses the sweeping method using 32× duplicate bit cells, and the sweep cycle is set to $2^{N-1}+1$, where N is the number of output bits. The simulation is performed at room temperature (27 °C) using 45 nm technology via Synopsys Hspice, and all transistors in bitcells use the minimum size considering the area, power, and speed. The proposed SRAM-CIM has reduced power consumption for vector-matrix multiplication by 99.96% compared to the existing state-of-the-art SRAM-CIM. Furthermore, because of the decoupled reading unit from an internal node of latch, there is no feedback from the reading unit, with read static noise, and margin-free results. Full article

This paper presents area optimization techniques for high-density spin-orbit torque magnetic random-access memories (SOT-MRAMs). Although SOT-MRAM has many desirable features of nonvolatility, high reliability and low write energy, it poses challenges to high-density memory implementation because of the use of two access transistors per cell. We first analyze the layout of the conventional SOT-MRAM bit-cell that includes two vertical metal lines, a bit-line and a source-line, limiting the horizontal dimension. We further propose two design techniques to reduce the horizontal dimension by decreasing the number of metal lines per cell without any performance overhead. Based on the fact that adjacent columns in a bit-interleaved array are not simultaneously accessed, the proposed techniques share a single source-line between two consecutive bit-cells in the same row. The simulation result shows that proposed techniques can achieve a bit-cell area reduction of 10–25% compared to the conventional SOT-MRAM. The comparison of our proposed designs with the standard spin-transfer torque MRAM shows 45% lower write energy, 84% lower read energy, and 2.3 × higher read-disturb margin. Full article