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Keywords = nanosoldering

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15 pages, 3813 KB  
Article
Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight
by Xuezhi Zhang, Jian Gao and Lanyu Zhang
Materials 2026, 19(7), 1418; https://doi.org/10.3390/ma19071418 - 2 Apr 2026
Viewed by 578
Abstract
This study investigates the effects of three group IV two-dimensional (2D) materials (graphene, silicene, and germanene) on the sintering process and tensile properties of copper nanoparticle pastes for electronic packaging. Using atomic-scale simulations, we constructed models of pure copper and composite pastes, tracking [...] Read more.
This study investigates the effects of three group IV two-dimensional (2D) materials (graphene, silicene, and germanene) on the sintering process and tensile properties of copper nanoparticle pastes for electronic packaging. Using atomic-scale simulations, we constructed models of pure copper and composite pastes, tracking particle rearrangement, neck formation, and pore closure under identical sintering conditions, followed by uniaxial tensile testing. All composites formed continuous copper networks, with densification rates increasing in the order: graphene < silicene < germanene. The yield strength of the pure copper paste was 2.41 GPa and increased to 2.96, 4.39, and 5.46 GPa with graphene, silicene, and germanene, respectively, corresponding to gains of about 23%, 82%, and 127% relative to pure copper. Increasing the sintering temperature led to a monotonic increase in the tensile strength of the germanene composite, with the highest value being obtained at 650 K. Dislocation and stress field analyses revealed that silicene and germanene strengthen the material by promoting pronounced plastic accommodation in neck regions, whereas graphene mainly redistributes strain along the interfaces and produces a more moderate increase in strength. These findings demonstrate that the strength and deformation mode of copper nano-solder joints can be effectively tuned by selecting the type of 2D filler and optimizing the sintering temperature. Full article
(This article belongs to the Section Advanced Nanomaterials and Nanotechnology)
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9 pages, 768 KB  
Editorial
Joining Technology Innovations at the Macro, Micro, and Nano Levels
by Anming Hu, Jolanta Janczak-Rusch and Tomokazu Sano
Appl. Sci. 2019, 9(17), 3568; https://doi.org/10.3390/app9173568 - 1 Sep 2019
Cited by 22 | Viewed by 5003
Abstract
With the growing joining requirements of emergent engineering materials and new applications, conventional welding continues to evolve at all scales spanning from the macro- down to the micro- and nanoscale. This mini review provides a comprehensive summary of the research hot spots in [...] Read more.
With the growing joining requirements of emergent engineering materials and new applications, conventional welding continues to evolve at all scales spanning from the macro- down to the micro- and nanoscale. This mini review provides a comprehensive summary of the research hot spots in this field, which includes but is not limited to selected papers from the international nanojoining and microjoining conference (NMJ) held in Nara, Japan on 1–4 December 2018. These innovations include the integration of nanotechnology, ultrafast laser, advanced manufacturing, and in situ real-time ultra-precision characterization into joining processes. This special issue may provide a relatively full picture of the state-of-the-art research progress, fundamental understanding, and promising application of modern joining technologies. Full article
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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