Search Results (24)

This study introduces a composite method that integrates a diamond-coated tubular grinding electrode with short electric arc machining (SEAM) for GH4099. Mechanical micro-grinding and arc erosion act concurrently within the inter-electrode gap, enabling an in situ “erode–dress” coupling in which the grinding action levels nascent craters and promotes debris evacuation while SEAM supplies localized thermal–electrical energy for removal. A design-of-experiment scheme probes discharge and grinding factors, and performance is evaluated by material removal behavior, electrode wear, and surface integrity. Within a robust window (12–24 V; 500–2000 r/min), the composite process sustains stable discharges without catastrophic melting at 24 V and yields dense, uniform textures. Representative surfaces show controllable areal roughness (Sa ≈ 14–27 µm across 80#–600#), reflecting a practical finishing–efficiency trade-off. Multi-scale characterization (3D topography, cross-sectional metallography, SEM) evidences suppression of recast steps, macro-protrusions, and irregular pits, with more evenly distributed, shallower grinding traces compared to those with single-mode SEAM. The comparative analyses clarify discharge stabilization and recast-layer mitigation mechanisms, establishing a feasible pathway to high-quality, high-efficiency composite SEAM of GH4099 without resorting to overly aggressive electrical conditions. Full article

The accurate modelling of material removal mechanisms in grinding processes requires precise constitutive equations describing dynamic material behaviour under extreme strain rates and large deformations. This study presents a novel methodology for optimising the Johnson–Cook (J–C) constitutive model parameters for micro-grinding applications, addressing the limitations of conventional mechanical testing at strain rates exceeding 10⁵ s⁻¹. The research employed single abrasive grain micro-cutting experiments using a diamond Vickers indenter on aluminium alloy 7075-T6 specimens. High-resolution topographic measurements (130 nm lateral resolution) were used to analyse the scratch geometry and lateral material displacement patterns. Ten modified J–C model variants (A1–A10) were systematically evaluated through finite element simulations, focusing on parameters governing plastic strengthening (B, n) and strain rate sensitivity (C). Quantitative non-conformity criteria assessed agreement between experimental and simulated results for cross-sectional areas and geometric shapes of material pile-ups and grooves. These criteria enable an objective evaluation by comparing the pile-up height (h), width (l), and horizontal distance to the peak (d). The results demonstrate that conventional J–C parameters from Hopkinson bar testing exhibit significant discrepancies in grinding conditions, with unrealistic stress values (17,000 MPa). The optimised model A3 (A = 473 MPa, B = 80 MPa, n = 0.5, C = 0.001) achieved superior convergence, reducing the non-conformity criteria to Σk_A = 0.46 and Σk_K = 1.16, compared to 0.88 and 1.67 for the baseline model. Strain mapping revealed deformation values from ε = 0.8 to ε = 11 in lateral pile-up regions, confirming the necessity of constitutive models describing material behaviour across wide strain ranges. The methodology successfully identified optimal parameter combinations, with convergence errors of 1–14% and 7–60% on the left and right scratch sides, respectively. The approach provides a cost-effective alternative to expensive dynamic testing methods, with applicability extending to other ductile materials in precision manufacturing. Full article

The surface quality of diamond wire sawing (DWS) wafers directly affects the efficiency and yield of subsequent processing steps. This paper investigates the motion trajectory of abrasives in ultrasonic-assisted diamond wire sawing (UADWS) and its mechanism for improving surface quality. The influence of ultrasonic vibration on the cutting arc length, cutting depth, and interference of multi-abrasive trajectories was analyzed through the establishment of an abrasive motion trajectory model. The ultrasonic vibration transforms the abrasive trajectory from linear to sinusoidal, thereby increasing the cutting arc length while reducing the cutting depth. A lower wire speed was found to be more conducive to exploiting the advantages of ultrasonic vibration. Furthermore, the intersecting interference of multi-abrasive trajectories contributes to enhanced surface quality. Experimental studies were conducted on monocrystalline silicon (mono-Si) to verify the effectiveness of ultrasonic vibration in improving surface morphology and reducing wire marks during the sawing process. The experimental results demonstrate that, compared with DWS, UADWS achieves a significantly lower surface roughness Ra and generates micro-pits. The ultrasonic vibration induces a micro-grinding effect on both peaks and valleys of wire marks, effectively reducing their peak–valley (PV) height. This study provides a theoretical basis for optimizing UADWS process parameters and holds significant implications for improving surface quality in mono-Si wafer slicing. Full article

Hastelloy is widely used in the manufacturing of high-temperature components in the aerospace industry because of its high strength and corrosion-resistant physical properties, as well as its ability to maintain excellent mechanical properties at high temperatures. However, with developments in science and technology, the amount of available components for use in high-temperature and corrosive environments is increasing, their structures are becoming more complex and varied, and requirements with regard to the surface quality of the components has also become more stringent. The integration of cold plasma (CP) and nano-lubricant minimum quantity lubrication (NMQL), within a multi-physics coupling-assisted micro-grinding process (CPNMQL), presents a promising strategy to overcome this bottleneck. In this paper, micro-grinding of Hastelloy C-276 was performed under dry, CP, NMQL, and CPNMQL conditions, respectively. Contact angle testing, X-ray photoelectron spectroscopy (XPS) analysis, and nano-scratch experiments were used to investigate the mechanism of CPNMQL and to compare the micro-milling performance under different cooling and lubrication conditions employing various characteristics such as grinding temperature, surface roughness, and 3D surface profile. The results showed that at different micro-grinding depths, the micro-grinding temperature and surface roughness were significantly reduced under CP, NMQL, and CPNMQL conditions compared to dry friction. Among them, CPNMQL showed the best performance, with 53.4% and 54.7% reductions in temperature and surface roughness, respectively, compared to the dry condition. Full article

The production of biomass ash (BA) is expected to increase in the future, as biomass is generally considered a carbon-neutral fuel. BA potentially concentrates heavy metals and trace elements at high levels. With the growing production of BA, its disposal in landfills or recycling must be addressed through solid waste policies and within the framework of a circular economy. Utilizing BA as a cement substitute solves disposal issues while offering environmental benefits aligned with the circular economy. However, the varying physical and chemical properties of BA, influenced by factors such as biomass type and combustion technique, necessitate more effective utilization strategies. Consequently, researchers are developing various treatment methods to ensure that BA meet the necessary requirements and do not pose problems such as heavy metal or chlorine leaching. These treatments facilitate the production of concrete with higher compressive strength at greater cement replacement levels, supporting greener construction practices. This review consolidates existing BA data and treatment methods, focusing on their impacts and efficiency. It also explores combined treatments and potential new approaches. By providing a foundation for future research and practical applications, this study aims to improve treatment techniques, helping the industry mitigate environmental risks and advance carbon-neutral construction solutions. Full article

The fabrication of micro-holes in hard-to-machine materials presents considerable challenges in precision machining. This study proposes a novel approach that employs high-strength micro-grinding tools with a central abrasive grain absence to create micro-holes through helical grinding. Due to the random distribution of abrasive grains, the absence of grains at the tool’s center becomes an inevitable technical challenge. This research examines the correlation between the diameter of the absence zone and the bottom morphology of the machined hole, highlighting the potential formation of disc-shaped or cylindrical residues. A model for predicting the height of the disc-shaped residues is developed, and the mechanisms governing their removal during grinding are further explored. The findings indicate that when a central grain absence exists, the first abrasive grain surrounding the absence zone, referred to as the inner-edge grain, is responsible for removing the disc-shaped residues. Based on these results, a novel 0.8 mm diameter micro-PCD milling–grinding tool with a central edge absence is designed, and experimental validation is performed using 65% SiCp/Al composite materials. The experimental results confirm that the central grain absence leads to the formation of disc-shaped residues at the bottom of the machined hole during helical grinding, and the morphology of the experimentally obtained residues aligns with the theoretical predictions and simulations. This study significantly advances micro-grinding wheel technology and provides a solid foundation for the precision machining of micro-holes in hard-to-machine materials. Full article

This article explores the intricacies of micro-grinding parameter control for hard and brittle materials, with a specific focus on Zirconia ceramics (ZrO₂) and Optical Glass (BK7). Given the increasing demand and application of these materials in various high-precision industries, this study aims to provide a comprehensive kinematic analysis of material removal during the micro-grinding process. According to the grinding parameters selected to be analyzed in this study, the a_c-max values are between (9.55 nm ~ 67.58 nm). Theoretical modeling of the grinding force considering the brittle and ductile removal phase, frictional effects, the possibility of grit to cut materials, and grinding conditions is very important in order to control and optimize the surface grinding process. This research introduces novel models for predicting and optimizing micro-grinding forces effectively. The primary objective is to establish a micro-grinding force model that facilitates the easy manipulation of micro-grinding parameters, thereby optimizing the machining process for these challenging materials. Through experimental investigations conducted on Zirconia ceramics, the paper evaluates a mathematical model of the grinding force, highlighting its significance in predicting and controlling the forces involved in micro-grinding. The suggested model underwent thorough testing to assess its validity, revealing an accuracy with average variances of 6.616% for the normal force and 5.752% for the tangential force. Additionally, the study delves into the coefficient of friction within the grinding process, suggesting a novel frictional force model. This model is assessed through a series of experiments on Optical Glass BK7, aiming to accurately characterize the frictional forces at play during grinding. The empirical results obtained from both sets of experiments—on Zirconia ceramics and Optical Glass BK7—substantiate the efficacy of the proposed models. These findings confirm the models’ capability to accurately describe the force dynamics in the micro-grinding of hard and brittle materials. The research not only contributes to the theoretical understanding of micro-grinding processes but also offers practical insights for enhancing the efficiency and effectiveness of machining operations involving hard and brittle materials. Full article

To investigate the micro-grinding process and performance of 2.5D C_f/SiC composites and 2.5D SiC_f/SiC composites in depth, single-factor micro-grinding experiments were conducted by using SiC ceramics as a comparison. Differences in the material removal process, surface microstructure, surface roughness, and grinding force of the three materials under the same grinding parameters were comparatively analyzed. The results indicate that crack propagation is severe during the micro-grinding process of SiC ceramics. The ground surface is uneven, accompanied by pit defects and large surface roughness Ra. However, the presence of reinforcing fibers and interfaces in the two types of composites can inhibit crack propagation or change their extension directions. Therefore, their surfaces are smooth and flat after grinding, with small defects and low surface roughness Ra. In addition, the grinding processes of the two composites are both related to fiber orientation. There are differences in crack propagation paths and fiber fracture positions in the weft fiber layer and the radial fiber layer, which result in different forms of grinding defects. During micro-grinding, the real-time force signals of 2.5D C_f/SiC composites and 2.5D SiC_f/SiC composites are relatively stable, while the signals of SiC ceramics have a large number of spikes. The average micro-grinding force of the three materials is: SiC ceramics > 2.5D SiC_f/SiC composites > 2.5D C_f/SiC composites. Full article

The application of hard and brittle materials such as single-crystal silicon in small parts has expanded sharply, and the requirements for their dimensional accuracy and processing surface quality have been continuously improved. This paper proposes using mechano-chemical micro-grinding tools to process single-crystal silicon, which can realize the high-quality and efficient processing of such tiny parts through mechano-chemical composite action. The microstructure composition of the mechano-chemical micro-grinding tools was designed, the theoretical analysis model of grinding force was established and verified by experiments, and the temperature field distribution during mechano-chemical micro-grinding of single-crystal silicon was simulated and studied, which provided a theoretical basis for mechano-chemical action. Special micro-grinding tools were developed, and mechano-chemical micro-grinding processing tests were carried out. The results show that the coupling synergy of grinding force and grinding temperature improves the chemical activity of the micro-grinding tools, thereby promoting the solid–solid phase chemical reaction of abrasives and additives at the sharp points of the surface of the micro-grinding tools. And when the content of cerium oxide abrasive is 25%, it is more conducive to the solid–solid phase chemical reaction, and calcium oxide can be used as an additive to promote the active agent of solid–solid phase chemical reaction, improve the degree of chemical reaction, and thus improve the removal rate of materials. Soft reactants that are easy to remove are generated on the surface of monocrystalline silicon and are removed by the mechanical friction between the abrasive grain and the surface of the silicon wafer, and finally achieve low-damage processing with a surface roughness of Ra1.332 nm, which is much better than the surface roughness of Ra96.363 nm after diamond abrasive processing. Full article

Although glass is in high demand as a material for microfluidic chips, it is still difficult to fabricate microstructures on glass. In this paper, polycrystalline diamond tools were fabricated through electrical discharge machining, and the microgrinding process for fused silica using the tools was studied. In order to improve the productivity, the machining effects of the high feed rate and depth of cut on the surface roughness of the channel bottoms and edge chipping were studied. A toolpath for the microchannels of a microfluidic chip was also studied and a microfluidic chip array was fabricated using this method. Full article

The main objective of this study was to develop cellulose nanofibers from the thermomechanical pulp (TMP) of Radiata Pine (Pinus radiata D. Don), and for this, a one-step micro-grinding process was used. The newly developed material was called thermomechanical pulp nanofibers (TMP-NF). In the first instance, a determination of the constituents of the TMP was carried out through a chemical characterization. Then, TMP-NFs were compared with cellulose nanofibers (CNF) by morphological analysis (Scanning Electron Microscopy, SEM, and Atomic Force Microscopy, AFM), X-ray Diffraction (XRD) and Fourier-Transform Infrared Spectroscopy with Attenuated Total Reflection (FTIR-ATR). In addition, films were developed from TMP-NF and CNF using a vacuum filtration manufacturing method. For this study, 0.10, 0.25, 0.50, and 1.00% dry weight of CNF and TMP-NF were used as continuous matrices without organic solvents. The films were characterized by determining their morphological, physical, surface properties, and mechanical properties. The main results showed that morphological analysis by SEM and AFM for the fractionated sample indicated a fiber diameter distribution in the range of 990-17 nm and an average length of 5.8 µm. XRD analysis showed a crystallinity index of 90.8% in the CNF, while in the TMP-NF, it was 71.2%, which was foreseeable. FTIR-ATR analysis showed the functional groups of lignin and hemicellulose present in the TMP-NF sample. The films presented apparent porosity values of 33.63 for 1.00% solids content of CNF and 33.27% for 0.25% solids content of TMP-NF. The contact angle was 61.50° for 0.50% solids content of CNF and 84.60° for 1.00% solids content of TMP-NF. Regarding the mechanical properties, the modulus of elasticity was 74.65 MPa for CNF and 36.17 MPa for TMP-NF, and the tensile strength was 1.07 MPa for CNF and 0.69 MPa for TMP-NF. Although the mechanical properties turned out to be higher in the CNF films, the TMP-NF films showed improved surface characteristics as to surface hydrophobic and apparent porosity. In addition, the easy and rapid obtaining of TMP nanofibers makes it a promising material that can be used in biologically based nanocomposites. Full article

Stabilizing the hydrophobic wetting state on a surface is essential in heat transfer and microfluidics. However, most hydrophobic surfaces of Si are primarily achieved through microtexturing with subsequent coating or modification of low surface energy materials. The coatings make the hydrophobic surface unstable and impractical in many industrial applications. In this work, the Si chips’ wettability transitions are yielded from the original hydrophilic state to a stable transitional hydrophobic state by texturing bamboo-leaf-like hierarchical structures (BLHSs) through a diamond grinding wheel with one-step forming. Experiments showed that the contact angles (CAs) on the BLHS surfaces increased to 97° and only reduced by 2% after droplet impacts. This is unmatched by the current texturing surface without modification. Moreover, the droplets can be split up and transferred by the BLHS surfaces with their 100% mass. When the BLHS surfaces are modified by the low surface energy materials’ coating, the hydrophobic BLHS surfaces are upgraded to be superhydrophobic (CA > 135°). More interestingly, the droplet can be completely self-sucked into a hollow micro-tube within 0.1 s without applying external forces. A new wetting model for BLHS surfaces based on the fractal theory is determined by comparing simulated values with the measured static contact angle of the droplets. The successful preparation of the bamboo-leaf-like Si confirmed that transitional wettability surfaces could be achieved by the micromachining of grinding on the hard and brittle materials. Additionally, this may expand the application potential of the key semiconductor material of Si. Full article

In this article, a method of grinding small ceramic elements using hyperboloid and conical grinding wheels was presented. The method allowed for machining with a lower material removal speed and extending the grinding zone without reducing the efficiency of the process. In order to assess the process output parameters, numerical simulations were carried out for single-pass machining. This strategy allows for automation of the process. Grinding with a low material removal speed is recommended for the machining of small and thin elements, since this can avoid fracturing the elements. The methodology for selecting process parameters as well as the results of the abrasive grains activity analyses were presented. The analyses also concerned the roughness of machined surfaces and the variability of their textures. This grinding method was applied in the production of small ceramic elements that are used in the construction of electronic systems, and in the processing of small piezoceramic parts. This grinding technique could also be used in other grinding processes, where the removal of small machining allowances with high efficiency is required. Full article

In this study, micro-grinding was performed to investigate the machining characteristics of alumina and zirconia. The machining of ceramics remains highly challenging owing to their properties, such as high brittleness and wear resistance, which leads to a shorter tool life and high machining costs. Polycrystalline diamond (PCD) was selected as the tool material, as it is suitable for machining hard and brittle materials, and micro-electrical discharge machining (EDM) was used to fabricate PCD micro-tools. When using a resistor-capacitor generator circuit in micro-EDM, the discharging energy is related to the working capacitance, and by controlling the working capacitance, the different edge radii and the surface roughness of the tool can be easily achieved. The feed rate, depth of cut, and rotation speed were set as experimental parameters to investigate the grinding characteristics of the ceramics. During the experiment, the grinding force and roughness of the bottom surface were monitored, and the roughness of the machined surfaces was measured using a three-dimensional surface profiler. A working capacitance of 1000 pF was used to fabricate a tool with an edge radius of 3.5 µm. The lower radius of the tool edge resulted in a decrease of the cutting force by 50% at most and a surface roughness of 19 nm Ra. Full article

K9 optical glass has superb material properties used for various industrial applications. However, the high hardness and low fracture toughness greatly fluctuate the cutting force generated during the grinding process, which are the main factors affecting machining accuracy and surface integrity. With a view to further understand the grinding mechanism of K9 glass and improve the machining quality, a new arithmetical force model and parameter optimization for grinding the K9 glass are introduced in this study. Originally, the grinding force components and the grinding path were analyzed according to the critical depth of plowing, rubbing, and brittle tear. Thereafter, the arithmetical model of grinding force was established based on the geometrical model of a single abrasive grain, taking into account the random distribution of grinding grains, and this fact was considered when establishing the number of active grains participating in cutting N_d-Tot. It should be noted that the tool diameter changed with machining, therefore this change was taking into account when building the arithmetical force model during processing as well as the variable value of the maximum chip thickness a_max accordingly. Besides, the force analysis recommends how to control the processing parameters to achieve high surface and subsurface quality. Finally, the force model was evaluated by comparing theoretical results with experimental ones. The experimental values of surface grinding forces are in good conformity with the predicted results with changes in the grinding parameters, which proves that the mathematical model is reliable. Full article