Search Results (4)

X-ray tomography is an effective non-destructive testing method for industrial quality control. Limited-angle tomography can be used to reduce the amount of data that need to be acquired and thereby speed up the process. In some industrial applications, however, objects are flat and layered, and laminography is preferred. It can deliver 2D images of the structure of a layered object at a particular depth from very limited data. An image at a particular depth is obtained by summing those parts of the data that contribute to that slice. This produces a sharp image of that slice while superimposing a blurred version of structures present at other depths. In this paper, we investigate an Optimal Experimental Design (OED) problem for laminography that aims to determine the optimal source positions. Not only can this be used to mitigate imaging artifacts, it can also speed up the acquisition process in cases where moving the source and detector is time-consuming (e.g., in robotic arm imaging systems). We investigate the imaging artifacts in detail through a modified Fourier Slice Theorem. We address the experimental design problem within the Bayesian risk framework using empirical Bayes risk minimization. Finally, we present numerical experiments on simulated data. Full article

Recently, considerable work has been directed at the development of an ultracompact X-ray free-electron laser (UCXFEL) based on emerging techniques in high-field cryogenic acceleration, with attendant dramatic improvements in electron beam brightness and state-of-the-art concepts in beam dynamics, magnetic undulators, and X-ray optics. A full conceptual design of a 1 nm (1.24 keV) UCXFEL with a length and cost over an order of magnitude below current X-ray free-electron lasers (XFELs) has resulted from this effort. This instrument has been developed with an emphasis on permitting exploratory scientific research in a wide variety of fields in a university setting. Concurrently, compact FELs are being vigorously developed for use as instruments to enable next-generation chip manufacturing through use as a high-flux, few nm lithography source. This new role suggests consideration of XFELs to urgently address emerging demands in the semiconductor device sector, as identified by recent national need studies, for new radiation sources aimed at chip manufacturing. Indeed, it has been shown that one may use coherent X-rays to perform 10–20 nm class resolution surveys of macroscopic, cm scale structures such as chips, using ptychographic laminography techniques. As the XFEL is a very promising candidate for realizing such methods, we present here an analysis of the issues and likely solutions associated with extending the UCXFEL to harder X-rays (above 7 keV), much higher fluxes, and increased levels of coherence, as well as methods of applying such a source for ptychographic laminography to microelectronic device measurements. We discuss the development path to move the concept to rapid realization of a transformative XFEL-based application, outlining both FEL and metrology system challenges. Full article

In this study, X-ray laminography is used to monitor the evolution of a model 3D packed bed porous medium on a chip (micromodels) undergoing reactive flows. The obtained 3D images are used to compute the fluid flow patterns and develop insights into dissolution mechanisms. This study is a first proof of concept study, with controlled micromodels, and could later be extended towards deeper understanding of the dissolution and precipitation processes occurring in porous media at the microscale, mechanisms which are relevant to many industrial areas including catalysis, geochemistry, energy, and waste storage in deep geological formations, etc. Full article

Synchrotron radiation (SR) and X-ray free electron laser (XFEL) are indispensable tools not only for the exploration of science but also for the evolution of industry. We used SR and XFEL to elucidate the mechanism and the effects of laser peening without coating (LPwC) which enhances the durability of metallic materials. X-ray diffraction (XRD) employing SR revealed that the residual stress (RS) in the top surface became compressive as the laser pulse irradiation density increased with appropriate overlapping of adjacent laser pulses. SR-based computed tomography (CT) was used to nondestructively reconstruct three-dimensional (3D) images of fatigue cracks in aluminum alloy, revealing that LPwC retarded crack propagation on the surface and inside of the sample. SR-based computed laminography (CL) was applied to friction stir welded (FSWed) aluminum alloy plates to visualize fatigue cracks propagating along the welds. The fatigue crack had complicated shape; however, it became a semi-ellipsoid once projected onto a plane perpendicular to the fatigue loading direction. Ultra-fast XRD using an XFEL was conducted to investigate the dynamic response of aluminum alloy to an impulsive pressure wave simulating the LPwC condition. The diffraction pattern changed from spotty to smooth, implying grain refinement or subgrain formation. Shifts in diffraction angles were also observed, coinciding with the pressure history of laser irradiation. The durations of the dynamic phenomena were less than 1 µs; it may be possible to use high-repetition lasers at frequencies greater than kHz to reduce LPwC processing times. Full article