Cybersecurity Challenges and Applications of AI in Engineering

A special issue of Technologies (ISSN 2227-7080).

Deadline for manuscript submissions: 1 July 2026 | Viewed by 59

Special Issue Editors


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Guest Editor
School of Engineering, University of Greenwich, Chatham, Kent ME4 4TB, UK
Interests: 5G/6G; antennas; AI; microwave devices; RF energy harvesting; IoT; wireless systems
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Architecture, Computing and Engineering, University of East London, London, UK
Interests: cybersecurity risk management; AI/ML in critical infrastructure protection; vulnerability assessment; penetration testing; cyber threat intelligence; AI cybersecurity

Special Issue Information

Dear Colleagues,

Artificial Intelligence (AI) in engineering has the potential to both enhance cybersecurity defenses through threat detection and automation and create new challenges such as cybercriminals leveraging AI for attacks like deepfakes and adaptive malware. Common applications include automating security tasks, improving threat detection, and enabling real-time incident response, while major challenges include adversarial attacks against AI models, data integration issues, ethical concerns, and the use of AI by attackers to create more sophisticated attacks.

This Special Issue aims to explore the interdisciplinary cybersecurity challenges related to the applications of AI in engineering. Authors are invited to submit their latest research findings for publication. Both regular articles and review papers are welcomed. Topics of interest include, but are not limited to, the following:

  • 5G/6G network architecture;
  • AI cybersecurity technologies;
  • Cyber threat intelligence;
  • RF energy harvesting challenges;
  • Critical infrastructure protection;
  • Smart connectivity and IoT integration;
  • Cybersecurity risk management techniques;
  • IoT security architectures;
  • RFID solutions and data fusion technologies;
  • Internet of Everything (IoE);
  • Machine learning and robotics;
  • Localization and tracking systems;
  • Smart healthcare and wearables;
  • Vulnerability assessment techniques;
  • Wireless power transfer and wireless sensors;
  • RF/microwave circuits, components, and systems.

Dr. Augustine O. Nwajana
Dr. Halima Kure
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Technologies is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 5G/6G network
  • cybersecurity
  • artificial intelligence (AI)
  • IoT security
  • metamaterials
  • RF energy harvesting
  • smart connectivity
  • IoT integration
  • smart healthcare
  • RFID
  • wireless systems

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Published Papers

This special issue is now open for submission.
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