Machine Learning in 3D Printing of Instrumentation and Device: Focus on Biomedical Engineering Aspects

A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and Innovation in Advanced Manufacturing".

Deadline for manuscript submissions: closed (15 April 2020) | Viewed by 400

Special Issue Editors


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Guest Editor
Division of Biomedical Engineering, University of Saskatchewan, Saskatoon, SK, Canada
Interests: space medicine; deep/machine learning; biomedical signal processing; 3D printing; medical device; thermography sensors; embedded systems

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Guest Editor
Department of Biomedical Engineering, Al-Nahrain University, Baghdad, Iraq
Interests: biomedical signals; embedded systems; machine learning; medical instrumentations; medical simulation and modeling; 3D prototyping

Special Issue Information

Dear Colleagues,

Recently, the increasing application of design with additive manufacturing methods such as 3D printing has contributed to remarkable advances in computer-aided design, engineering and manufacturing technologies, multivariable analysis and simulation tools, data management, clinical imaging, rapid prototyping, micro/nano fabrication methods, and bio-mimetic design, all of which provide new perspectives for biomedical device and instrumentation production. This Special Issue will discuss these topics in depth, with an applied perspective and providing several high-standard studies that lead to the development of a novel biomedical device, from the conceptual and design steps to the prototyping, validation, and industrialization phases. We therefore invite all respected researchers and scholars to submit their works to this Special Issue in Inventions.

Dr. Abbas Al-Zubaidi
Dr. Ahmed F. Hussein
Guest Editors

Manuscript Submission Information

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Keywords

  • Machine learning
  • Inventions
  • 3D printing
  • Medical devices
  • Microelectronic and electrical instrumentation
  • Intelligent parametric design

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Published Papers

There is no accepted submissions to this special issue at this moment.
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