Materials | 2021 International Conference on Materials: Advanced and Emerging Materials (ICM-CN 2021)—Open for Submission

It is with great enthusiasm that we announce the 2021 International Conference on Materials: Advanced and Emerging Materials (ICM-CN 2021). The conference is organized by the MDPI open access journal Materials (Impact Factor 3.057) and co-organized by the Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). It will be held in Shenzhen, Guangdong, China, from the 21st to 24th November 2021.

This conference will provide leading scientists working in this field with a platform to share their latest research and engage in exciting discussions.

The main topics of the conference include but are not limited to:

Electronic material;
Biomaterials;
Smart materials;
Energy materials;
Advanced composites;
Rare-earth materials;
Optics and photonics;
Advanced nanomaterials and nanotechnology;
Structure materials and their application;
Porous materials;
Polymeric materials;
Quantum materials.

After the conference, all accepted conference papers will be published in the proceedings of this conference within a dedicated issue of the MDPI journal Materials Proceedings. In addition, all participants will be encouraged to submit an extended full manuscript to one dedicated Special Issue in Materials with a 500 CHF discount on the Article Processing Charge (APC).

We hope that you will join this symposium to exchange ideas, communicate fruitful collaborations, and make this conference a success.

For more information, please visit the conference official website: https://2021icm-cn.sciforum.net/.