On 27 January 2026, MDPI and the journals Chips, Hardware, Microelectronics, Electronics, JLPEA, and Microwave will host a webinar titled “MDPI’s Journal Cluster of Electronic Engineering and Hardware Systems Webinar | Custom Microelectronic Systems for IoT and Sensing Applications”.

Electronic engineering and hardware systems focus on the design, development, and testing of electronic circuits, devices, and systems, including both hardware and software components. This field encompasses a wide range of applications, from basic electronic components to complex systems.

Date: 27 January 2026
Time: 5:00 p.m. CET | 11:00 a.m. EST
Webinar ID: 899 4357 8641

Register now for free!

After registering, you will receive a confirmation email containing information on how to join the webinar. Registrations with academic or institutional email addresses will be prioritized

Unable to attend? Feel free to register nonetheless; we will inform you once a recording of the webinar becomes available.

Webinar Chair and Keynote Speakers:

• Prof. Dr. Kenneth Loh, Department of Structural Engineering, Materials Science & Engineering Program, University of California, San Diego, USA;
• Dr. Andrea Ria, Department of Information Engineering, University of Pisa, Pisa - Italy, National Institute of Nuclear Physics, Section of Pisa - Italy, Teaching and Learning Centre, University of Pisa, Pisa – Italy;
• Prof. Dr. Theodore Hughes-Riley, Advanced Textiles Research Group, Nottingham School of Art and Design, Nottingham Trent University, Nottingham, United Kingdom.

Relevant Special Issues:
“Sensing Technologies for Human Evaluation, Testing and Assessment”
Guest Editors: Prof. Kenneth Loh, Dr. Said Quqa, Dr. Liming Salvino, and Prof. Dr. Ning Xi
Deadline for submission: 25 March 2026

“Advancements and Challenges in IoT Communication Technologies for a Connected World: 2nd Edition”
Guest Editors: Dr. Andrea Ria, Dr. Francesco Paolo Chietera, and Dr. Xiao Tang
Deadline for submission: 20 January 2026

“Challenges and Future Trends in Electronics for Wireless Sensing Technology”
Guest Editors: Dr. Andrea Ria, Dr. Andrea Motroni, and Dr. Antonello Florio
Deadline for submission: 25 April 2026

“Low Power Sensing and Energy Harvesting for Self-Sustained Electronics”
Guest Editors: Prof. Dr. Bingang Xu and Dr. Yujue Yang
Deadline for submission: 30 May 2026

“Neuromorphic Chips at the Intersection of Neuroscience, Electronics and AI”
Guest Editors: Dr. Liangshun Wu and Dr. Pak Kwong Chan
Deadline for submission: 29 April 2026

“Applications of MEMS and QCM in Smart Sensor Systems”
Guest Editors: Dr. Jianguo Hu, Dr. Jing Chen, Dr. Xiangshun Geng, Dr. Guangyang Gou, and Dr. Qiao Chen
Deadline for submission: 14 April 2025

Relevant Papers:
“A High-Efficiency Piezoelectric Energy Harvesting and Management Circuit Based on Full-Bridge Rectification”
by Shuhan Liu, Suhao Chen, Wei Gao, Jiabin Zhang, Dacheng Xu, Fang Chen, Zhenghao Lu and Xiaopeng Yu
J. Low Power Electron. Appl. 2024, 14(4), 49; https://doi.org/10.3390/jlpea14040049

“Electro-Physical Model of Amorphous Silicon Junction Field-Effect Transistors for Energy-Efficient Sensor Interfaces in Lab-on-Chip Platforms”
by Nicola Lovecchio, Giulia Petrucci, Fabio Cappelli, Martina Baldini, Vincenzo Ferrara, Augusto Nascetti, Giampiero de Cesare and Domenico Caputo
Chips 2026, 5(1), 1; https://doi.org/10.3390/chips5010001

“Design and Analysis of 3–12 GHz UWB Flat Gain LNA in 0.15 µm GaAs pHEMT Technology”
by Tugba Haykir Ergin, Utku Tuncel, Serkan Topaloglu and Hüseyin Arda Ülkü
Electronics 2025, 14(16), 3272; https://doi.org/10.3390/electronics14163272

“Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies”
by Jamal M. Deen
Microelectronics 2025, 1(1), 1; https://doi.org/10.3390/microelectronics1010001

For more information about this webinar, please visit the following link: https://sciforum.net/event/Cluster-5.

If you have any questions about this webinar, please contact journal.webinar@mdpi.com.