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Journal: Chips, 2023
Volume: 2
Number: 12

Article: Synergistic Verification of Hardware Peripherals through Virtual Prototype Aided Cross-Level Methodology Leveraging Coverage-Guided Fuzzing and Co-Simulation
Authors: by Sallar Ahmadi-Pour, Mathis Logemann, Vladimir Herdt and Rolf Drechsler
Link: https://www.mdpi.com/2674-0729/2/3/12

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