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Abstract

Dual Function WS2 Thin-Films as a Substrate for Ultrafast Response Thermocouple to Temperature Evaluation in µinjection Molding †

1
CEMMPRE—Centre for Mechanical Engineering, Materials and Processes, University of Coimbra, Rua Luís Reis Santos, 3030-788 Coimbra, Portugal
2
Edilásio Carreira da Silva, Lda, Rua Aníbal Henriques Abrantes, S/N, 2430-418 Marinha Grande, Portugal
3
CeNTI—Centre of Nanotechnology and Smart Materials, Rua Fernando Mesquita 2785, 4760-034 Vila Nova de Famalicão, Portugal
*
Authors to whom correspondence should be addressed.
Presented at the Materiais 2022, Marinha Grande, Portugal, 10–13 April 2022.
Mater. Proc. 2022, 8(1), 47; https://doi.org/10.3390/materproc2022008047
Published: 27 May 2022
(This article belongs to the Proceedings of MATERIAIS 2022)
Nowadays, mold and plastics companies are aware of markets’ increasing globalization, which leads to enhanced competition in the industrial environment. This requires the best conditions of productive flexibility to overcome the challenges. An example is the microfabrication process, initially applied in integrated circuits in the production of up to several small-scale components today [1]. Injection molding microfabrication allows the production of parts/systems/devices or their features, where the scale is sub-millimeter, based on polymeric materials, at high series and complex geometries in relatively short periods. However, this technology involves a rigorous control process to ensure the quality of the injected microcomponents. Therefore, the injected material must be distributed evenly inside the μmold to minimize the occurrence of defects during the process, which is dependent on the injection pressure during the process and the mixture viscosity. Since viscosity is related directly to the temperature inside the mold, an ultra-fast response of temperature sensors is necessary. This requirement requires thin-film thermocouples to be deposited on the critical zones of the mold (i.e., inserts). However, the μmold must have a coating to achieve two purposes: improve the lifetime of the mold and contribute to the part/system/device extraction. A WS2-based coating with the addition of C (W-S-C) was demonstrated to be the solution concerning high hardness and very low friction coefficient. However, the carbon presence excludes the possibility of this coating being used as a substrate to deposit an ultra-fast thermocouple (T-type). The present study shows that another type of WS2 (W-S-N) film has a lower electrical conductivity than the other kinds of WS2 coatings and maintains the characteristics of mold surface coatings. The W-S-N film also allows for temperature evaluations with precision and ultra-fast responses (microseconds). Studies about the optimization of thermocouple thickness have shown that 300 nm induced a superior signal sensitivity.

Author Contributions

Conceptualization, T.V. and A.P.; methodology, T.R., M.E. and H.P.; validation, T.V. and A.P.; investigation, T.V.; writing—original draft preparation, T.V. and T.R.; writing—review and editing, T.V. and T.R.; supervision, T.V. All authors have read and agreed to the published version of the manuscript.

Funding

This work was supported by the European Regional Development Fund (ERDF) under the Portuguese program—Programa Operacional Factores de Competitividade (COMPETE) (grant agreement No. POCI-01-0247-FEDER-024516); this research is also sponsored by FEDER funds through the program COMPETE—Programa Operacional Factores de Competitividade—and by national funds through FCT—Fundação para a Ciência e a Tecnologia, under the project UIDB/00285/2020.

Institutional Review Board Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

Not applicable.

Conflicts of Interest

The authors declare no conflict of interest.

Reference

  1. De Santis, F.; Roberto, P. Development of a Rapid Surface Temperature Variation System and Application to Micro-Injection Molding. J. Mater. Processing Technol. 2016, 237, 1–11. [Google Scholar] [CrossRef]
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MDPI and ACS Style

Resendes, T.; Evaristo, M.; Pina, A.; Pizarro, H.; Vieira, T. Dual Function WS2 Thin-Films as a Substrate for Ultrafast Response Thermocouple to Temperature Evaluation in µinjection Molding. Mater. Proc. 2022, 8, 47. https://doi.org/10.3390/materproc2022008047

AMA Style

Resendes T, Evaristo M, Pina A, Pizarro H, Vieira T. Dual Function WS2 Thin-Films as a Substrate for Ultrafast Response Thermocouple to Temperature Evaluation in µinjection Molding. Materials Proceedings. 2022; 8(1):47. https://doi.org/10.3390/materproc2022008047

Chicago/Turabian Style

Resendes, Tomás, Manuel Evaristo, António Pina, Henrique Pizarro, and Teresa Vieira. 2022. "Dual Function WS2 Thin-Films as a Substrate for Ultrafast Response Thermocouple to Temperature Evaluation in µinjection Molding" Materials Proceedings 8, no. 1: 47. https://doi.org/10.3390/materproc2022008047

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